Characterization of copper conductive ink for low temperature sintering processing on flexible polymer substrate

Jaewon Kim; Byunghoon Lee; Jun Yan Lek; Riko I. Made; Budiman Salam; Chee Lip Gan

doi:10.1109/EPTC.2014.7028308

Characterization of copper conductive ink for low temperature sintering processing on flexible polymer substrate

Jaewon Kim, Byunghoon Lee, Jun Yan Lek, Riko I. Made, Budiman Salam, Chee Lip Gan

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

7 Citations (Scopus)

Abstract

Printed interconnects on flexible substrates using copper nanoparticles ink is attractive because of its lower material cost, lower electrical resistivity and higher electromigration resistance as compared to gold or silver-based ink. However, Cu nanoparticles oxidize easily during the sintering process, which has an adverse effect on its quality and reliability. Thus, it requires process modifications such as sintering in an inert environment to reduce the oxidation effects. In this paper, the properties of nano-sized Cu particles ink-jet printed conductive films that were sintered in N₂ environment are investigated. The sheet resistance and microstructure of the Cu films were monitored as a function of temperature.

Original language	English
Title of host publication	Proceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	27-30
Number of pages	4
ISBN (Electronic)	9781479969944
DOIs	https://doi.org/10.1109/EPTC.2014.7028308
Publication status	Published - Jan 30 2014
Externally published	Yes
Event	2014 16th IEEE Electronics Packaging Technology Conference, EPTC 2014 - Singapore, Singapore Duration: Dec 3 2014 → Dec 5 2014

Publication series

Name	Proceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014

Conference

Conference	2014 16th IEEE Electronics Packaging Technology Conference, EPTC 2014
Country/Territory	Singapore
City	Singapore
Period	12/3/14 → 12/5/14

Bibliographical note

Publisher Copyright:
© 2014 IEEE.

ASJC Scopus Subject Areas

Electrical and Electronic Engineering

Access to Document

10.1109/EPTC.2014.7028308

Cite this

Kim, J., Lee, B., Lek, J. Y., Made, R. I., Salam, B., & Gan, C. L. (2014). Characterization of copper conductive ink for low temperature sintering processing on flexible polymer substrate. In Proceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014 (pp. 27-30). Article 7028308 (Proceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EPTC.2014.7028308

Kim, Jaewon ; Lee, Byunghoon ; Lek, Jun Yan et al. / Characterization of copper conductive ink for low temperature sintering processing on flexible polymer substrate. Proceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014. Institute of Electrical and Electronics Engineers Inc., 2014. pp. 27-30 (Proceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014).

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title = "Characterization of copper conductive ink for low temperature sintering processing on flexible polymer substrate",

abstract = "Printed interconnects on flexible substrates using copper nanoparticles ink is attractive because of its lower material cost, lower electrical resistivity and higher electromigration resistance as compared to gold or silver-based ink. However, Cu nanoparticles oxidize easily during the sintering process, which has an adverse effect on its quality and reliability. Thus, it requires process modifications such as sintering in an inert environment to reduce the oxidation effects. In this paper, the properties of nano-sized Cu particles ink-jet printed conductive films that were sintered in N2 environment are investigated. The sheet resistance and microstructure of the Cu films were monitored as a function of temperature.",

author = "Jaewon Kim and Byunghoon Lee and Lek, {Jun Yan} and Made, {Riko I.} and Budiman Salam and Gan, {Chee Lip}",

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Kim, J, Lee, B, Lek, JY, Made, RI, Salam, B & Gan, CL 2014, Characterization of copper conductive ink for low temperature sintering processing on flexible polymer substrate. in Proceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014., 7028308, Proceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014, Institute of Electrical and Electronics Engineers Inc., pp. 27-30, 2014 16th IEEE Electronics Packaging Technology Conference, EPTC 2014, Singapore, Singapore, 12/3/14. https://doi.org/10.1109/EPTC.2014.7028308

Characterization of copper conductive ink for low temperature sintering processing on flexible polymer substrate. / Kim, Jaewon; Lee, Byunghoon; Lek, Jun Yan et al.
Proceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014. Institute of Electrical and Electronics Engineers Inc., 2014. p. 27-30 7028308 (Proceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

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AU - Kim, Jaewon

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AB - Printed interconnects on flexible substrates using copper nanoparticles ink is attractive because of its lower material cost, lower electrical resistivity and higher electromigration resistance as compared to gold or silver-based ink. However, Cu nanoparticles oxidize easily during the sintering process, which has an adverse effect on its quality and reliability. Thus, it requires process modifications such as sintering in an inert environment to reduce the oxidation effects. In this paper, the properties of nano-sized Cu particles ink-jet printed conductive films that were sintered in N2 environment are investigated. The sheet resistance and microstructure of the Cu films were monitored as a function of temperature.

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Kim J, Lee B, Lek JY, Made RI, Salam B, Gan CL. Characterization of copper conductive ink for low temperature sintering processing on flexible polymer substrate. In Proceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014. Institute of Electrical and Electronics Engineers Inc. 2014. p. 27-30. 7028308. (Proceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014). doi: 10.1109/EPTC.2014.7028308

Characterization of copper conductive ink for low temperature sintering processing on flexible polymer substrate

Abstract

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