Copper micro and nano particles mixture for 3D interconnections application

Yuan Yuan Dai; Mei Zhen Ng; P. Anantha; Chee Lip Gan; Chuan Seng Tan

doi:10.1109/3DIC.2015.7334614

Copper micro and nano particles mixture for 3D interconnections application

Yuan Yuan Dai, Mei Zhen Ng, P. Anantha, Chee Lip Gan, Chuan Seng Tan^*

^*Corresponding author for this work

Nanyang Technological University

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

7 Citations (Scopus)

Abstract

A novel copper paste with copper micro particles mixed with copper nanoparticles is proposed in this study. The mixed ratio between the two kinds of particles is simulated based on the Monte Carlo method. The copper micro particles are assumed to have a Face-Centered-Cubic (FCC) structure and the nanoparticles are filled randomly in the interstices between micro particles. The nanoparticles arrangement with maximum occupancy in the interstitial space is calculated, which enable its weight percentage estimation. Based on the simulation results, experiments are carried out to examine the micro paste, nano paste and mixed paste quality by optical microscope, contact angle measurements and thermogravimetric analysis (TGA). The experimental results reveal that the mixed paste is denser in structure and has a lower transition temperature.

Original language	English
Title of host publication	2015 International 3D Systems Integration Conference, 3DIC 2015
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	TS8.9.1-TS8.9.5
ISBN (Electronic)	9781467393850
DOIs	https://doi.org/10.1109/3DIC.2015.7334614
Publication status	Published - Nov 20 2015
Externally published	Yes
Event	International 3D Systems Integration Conference, 3DIC 2015 - Sendai, Japan Duration: Aug 31 2015 → Sept 2 2015

Publication series

Name	2015 International 3D Systems Integration Conference, 3DIC 2015

Conference

Conference	International 3D Systems Integration Conference, 3DIC 2015
Country/Territory	Japan
City	Sendai
Period	8/31/15 → 9/2/15

Bibliographical note

Publisher Copyright:
© 2015 IEEE.

ASJC Scopus Subject Areas

Electrical and Electronic Engineering

Keywords

conductive paste
copper particles
low temperature sintering
packing density

Access to Document

10.1109/3DIC.2015.7334614

Cite this

Dai, Y. Y., Ng, M. Z., Anantha, P., Gan, C. L., & Tan, C. S. (2015). Copper micro and nano particles mixture for 3D interconnections application. In 2015 International 3D Systems Integration Conference, 3DIC 2015 (pp. TS8.9.1-TS8.9.5). Article 7334614 (2015 International 3D Systems Integration Conference, 3DIC 2015). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/3DIC.2015.7334614

@inproceedings{a3b1fee9ae4640dbb8a8b365c0f36a3c,

title = "Copper micro and nano particles mixture for 3D interconnections application",

abstract = "A novel copper paste with copper micro particles mixed with copper nanoparticles is proposed in this study. The mixed ratio between the two kinds of particles is simulated based on the Monte Carlo method. The copper micro particles are assumed to have a Face-Centered-Cubic (FCC) structure and the nanoparticles are filled randomly in the interstices between micro particles. The nanoparticles arrangement with maximum occupancy in the interstitial space is calculated, which enable its weight percentage estimation. Based on the simulation results, experiments are carried out to examine the micro paste, nano paste and mixed paste quality by optical microscope, contact angle measurements and thermogravimetric analysis (TGA). The experimental results reveal that the mixed paste is denser in structure and has a lower transition temperature.",

keywords = "conductive paste, copper particles, low temperature sintering, packing density",

author = "Dai, {Yuan Yuan} and Ng, {Mei Zhen} and P. Anantha and Gan, {Chee Lip} and Tan, {Chuan Seng}",

note = "Publisher Copyright: {\textcopyright} 2015 IEEE.; International 3D Systems Integration Conference, 3DIC 2015 ; Conference date: 31-08-2015 Through 02-09-2015",

year = "2015",

month = nov,

day = "20",

doi = "10.1109/3DIC.2015.7334614",

language = "English",

series = "2015 International 3D Systems Integration Conference, 3DIC 2015",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

pages = "TS8.9.1--TS8.9.5",

booktitle = "2015 International 3D Systems Integration Conference, 3DIC 2015",

address = "United States",

}

Dai, YY, Ng, MZ, Anantha, P, Gan, CL & Tan, CS 2015, Copper micro and nano particles mixture for 3D interconnections application. in 2015 International 3D Systems Integration Conference, 3DIC 2015., 7334614, 2015 International 3D Systems Integration Conference, 3DIC 2015, Institute of Electrical and Electronics Engineers Inc., pp. TS8.9.1-TS8.9.5, International 3D Systems Integration Conference, 3DIC 2015, Sendai, Japan, 8/31/15. https://doi.org/10.1109/3DIC.2015.7334614

Copper micro and nano particles mixture for 3D interconnections application. / Dai, Yuan Yuan; Ng, Mei Zhen; Anantha, P. et al.
2015 International 3D Systems Integration Conference, 3DIC 2015. Institute of Electrical and Electronics Engineers Inc., 2015. p. TS8.9.1-TS8.9.5 7334614 (2015 International 3D Systems Integration Conference, 3DIC 2015).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

TY - GEN

T1 - Copper micro and nano particles mixture for 3D interconnections application

AU - Dai, Yuan Yuan

AU - Ng, Mei Zhen

AU - Anantha, P.

AU - Gan, Chee Lip

AU - Tan, Chuan Seng

PY - 2015/11/20

Y1 - 2015/11/20

N2 - A novel copper paste with copper micro particles mixed with copper nanoparticles is proposed in this study. The mixed ratio between the two kinds of particles is simulated based on the Monte Carlo method. The copper micro particles are assumed to have a Face-Centered-Cubic (FCC) structure and the nanoparticles are filled randomly in the interstices between micro particles. The nanoparticles arrangement with maximum occupancy in the interstitial space is calculated, which enable its weight percentage estimation. Based on the simulation results, experiments are carried out to examine the micro paste, nano paste and mixed paste quality by optical microscope, contact angle measurements and thermogravimetric analysis (TGA). The experimental results reveal that the mixed paste is denser in structure and has a lower transition temperature.

AB - A novel copper paste with copper micro particles mixed with copper nanoparticles is proposed in this study. The mixed ratio between the two kinds of particles is simulated based on the Monte Carlo method. The copper micro particles are assumed to have a Face-Centered-Cubic (FCC) structure and the nanoparticles are filled randomly in the interstices between micro particles. The nanoparticles arrangement with maximum occupancy in the interstitial space is calculated, which enable its weight percentage estimation. Based on the simulation results, experiments are carried out to examine the micro paste, nano paste and mixed paste quality by optical microscope, contact angle measurements and thermogravimetric analysis (TGA). The experimental results reveal that the mixed paste is denser in structure and has a lower transition temperature.

KW - conductive paste

KW - copper particles

KW - low temperature sintering

KW - packing density

UR - http://www.scopus.com/inward/record.url?scp=84962207020&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84962207020&partnerID=8YFLogxK

U2 - 10.1109/3DIC.2015.7334614

DO - 10.1109/3DIC.2015.7334614

M3 - Conference contribution

AN - SCOPUS:84962207020

T3 - 2015 International 3D Systems Integration Conference, 3DIC 2015

SP - TS8.9.1-TS8.9.5

BT - 2015 International 3D Systems Integration Conference, 3DIC 2015

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - International 3D Systems Integration Conference, 3DIC 2015

Y2 - 31 August 2015 through 2 September 2015

ER -

Dai YY, Ng MZ, Anantha P, Gan CL, Tan CS. Copper micro and nano particles mixture for 3D interconnections application. In 2015 International 3D Systems Integration Conference, 3DIC 2015. Institute of Electrical and Electronics Engineers Inc. 2015. p. TS8.9.1-TS8.9.5. 7334614. (2015 International 3D Systems Integration Conference, 3DIC 2015). doi: 10.1109/3DIC.2015.7334614

Copper micro and nano particles mixture for 3D interconnections application

Abstract

Publication series

Conference

Bibliographical note

ASJC Scopus Subject Areas

Keywords

Access to Document

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