Copper nanoparticle paste on different metallic substrates for low temperature bonded interconnection

Jaewon Kim; Byunghoon Lee; Ja Myeong Koo; Chee Lip Gan

doi:10.1109/EPTC.2017.8277556

Copper nanoparticle paste on different metallic substrates for low temperature bonded interconnection

Jaewon Kim, Byunghoon Lee, Ja Myeong Koo, Chee Lip Gan

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

4 Citations (Scopus)

Abstract

Even though tin-based lead-free solder is now commonly used in the electronics industry, new materials are still being investigated for superior properties such as metallic nanoparticles. In this study, we evaluate our recently developed copper nanoparticles paste (nano Cu) as a joining material between metallized component and metallized substrate. The size of our copper nanoparticles allows bonding to occur at a low temperature compatible with electronics devices. We studied the electrical and mechanical properties of the bonded component and substrate with different metallized surfaces such as Cu or Au. Good bonds can be achieved with Au surfaces while for Cu surfaces, acid pre-cleaning is required to improve the bond strength between nanoCu paste and Cu surface due to native oxide.

Original language	English
Title of host publication	2017 IEEE 19th Electronics Packaging Technology Conference, EPTC 2017
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	1-4
Number of pages	4
ISBN (Electronic)	9781538630426
DOIs	https://doi.org/10.1109/EPTC.2017.8277556
Publication status	Published - Jul 2 2017
Externally published	Yes
Event	2017 19th IEEE Electronics Packaging Technology Conference, EPTC 2017 - Singapore, Singapore Duration: Dec 6 2017 → Dec 9 2017

Publication series

Name	2017 IEEE 19th Electronics Packaging Technology Conference, EPTC 2017
Volume	2018-February

Conference

Conference	2017 19th IEEE Electronics Packaging Technology Conference, EPTC 2017
Country/Territory	Singapore
City	Singapore
Period	12/6/17 → 12/9/17

Bibliographical note

Publisher Copyright:
© 2017 IEEE.

ASJC Scopus Subject Areas

Electrical and Electronic Engineering
Electronic, Optical and Magnetic Materials
Metals and Alloys
Polymers and Plastics

Access to Document

10.1109/EPTC.2017.8277556

Cite this

Kim, J., Lee, B., Koo, J. M., & Gan, C. L. (2017). Copper nanoparticle paste on different metallic substrates for low temperature bonded interconnection. In 2017 IEEE 19th Electronics Packaging Technology Conference, EPTC 2017 (pp. 1-4). (2017 IEEE 19th Electronics Packaging Technology Conference, EPTC 2017; Vol. 2018-February). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EPTC.2017.8277556

Kim, Jaewon ; Lee, Byunghoon ; Koo, Ja Myeong et al. / Copper nanoparticle paste on different metallic substrates for low temperature bonded interconnection. 2017 IEEE 19th Electronics Packaging Technology Conference, EPTC 2017. Institute of Electrical and Electronics Engineers Inc., 2017. pp. 1-4 (2017 IEEE 19th Electronics Packaging Technology Conference, EPTC 2017).

@inproceedings{77c7410128a34dba9a82a4940671a2b6,

title = "Copper nanoparticle paste on different metallic substrates for low temperature bonded interconnection",

abstract = "Even though tin-based lead-free solder is now commonly used in the electronics industry, new materials are still being investigated for superior properties such as metallic nanoparticles. In this study, we evaluate our recently developed copper nanoparticles paste (nano Cu) as a joining material between metallized component and metallized substrate. The size of our copper nanoparticles allows bonding to occur at a low temperature compatible with electronics devices. We studied the electrical and mechanical properties of the bonded component and substrate with different metallized surfaces such as Cu or Au. Good bonds can be achieved with Au surfaces while for Cu surfaces, acid pre-cleaning is required to improve the bond strength between nanoCu paste and Cu surface due to native oxide.",

author = "Jaewon Kim and Byunghoon Lee and Koo, \{Ja Myeong\} and Gan, \{Chee Lip\}",

note = "Publisher Copyright: {\textcopyright} 2017 IEEE.; 2017 19th IEEE Electronics Packaging Technology Conference, EPTC 2017 ; Conference date: 06-12-2017 Through 09-12-2017",

year = "2017",

month = jul,

day = "2",

doi = "10.1109/EPTC.2017.8277556",

language = "English",

series = "2017 IEEE 19th Electronics Packaging Technology Conference, EPTC 2017",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

pages = "1--4",

booktitle = "2017 IEEE 19th Electronics Packaging Technology Conference, EPTC 2017",

address = "United States",

}

Kim, J, Lee, B, Koo, JM & Gan, CL 2017, Copper nanoparticle paste on different metallic substrates for low temperature bonded interconnection. in 2017 IEEE 19th Electronics Packaging Technology Conference, EPTC 2017. 2017 IEEE 19th Electronics Packaging Technology Conference, EPTC 2017, vol. 2018-February, Institute of Electrical and Electronics Engineers Inc., pp. 1-4, 2017 19th IEEE Electronics Packaging Technology Conference, EPTC 2017, Singapore, Singapore, 12/6/17. https://doi.org/10.1109/EPTC.2017.8277556

Copper nanoparticle paste on different metallic substrates for low temperature bonded interconnection. / Kim, Jaewon; Lee, Byunghoon; Koo, Ja Myeong et al.
2017 IEEE 19th Electronics Packaging Technology Conference, EPTC 2017. Institute of Electrical and Electronics Engineers Inc., 2017. p. 1-4 (2017 IEEE 19th Electronics Packaging Technology Conference, EPTC 2017; Vol. 2018-February).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

TY - GEN

T1 - Copper nanoparticle paste on different metallic substrates for low temperature bonded interconnection

AU - Kim, Jaewon

AU - Lee, Byunghoon

AU - Koo, Ja Myeong

AU - Gan, Chee Lip

PY - 2017/7/2

Y1 - 2017/7/2

N2 - Even though tin-based lead-free solder is now commonly used in the electronics industry, new materials are still being investigated for superior properties such as metallic nanoparticles. In this study, we evaluate our recently developed copper nanoparticles paste (nano Cu) as a joining material between metallized component and metallized substrate. The size of our copper nanoparticles allows bonding to occur at a low temperature compatible with electronics devices. We studied the electrical and mechanical properties of the bonded component and substrate with different metallized surfaces such as Cu or Au. Good bonds can be achieved with Au surfaces while for Cu surfaces, acid pre-cleaning is required to improve the bond strength between nanoCu paste and Cu surface due to native oxide.

AB - Even though tin-based lead-free solder is now commonly used in the electronics industry, new materials are still being investigated for superior properties such as metallic nanoparticles. In this study, we evaluate our recently developed copper nanoparticles paste (nano Cu) as a joining material between metallized component and metallized substrate. The size of our copper nanoparticles allows bonding to occur at a low temperature compatible with electronics devices. We studied the electrical and mechanical properties of the bonded component and substrate with different metallized surfaces such as Cu or Au. Good bonds can be achieved with Au surfaces while for Cu surfaces, acid pre-cleaning is required to improve the bond strength between nanoCu paste and Cu surface due to native oxide.

UR - http://www.scopus.com/inward/record.url?scp=85050655512&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85050655512&partnerID=8YFLogxK

U2 - 10.1109/EPTC.2017.8277556

DO - 10.1109/EPTC.2017.8277556

M3 - Conference contribution

AN - SCOPUS:85050655512

T3 - 2017 IEEE 19th Electronics Packaging Technology Conference, EPTC 2017

SP - 1

EP - 4

BT - 2017 IEEE 19th Electronics Packaging Technology Conference, EPTC 2017

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 2017 19th IEEE Electronics Packaging Technology Conference, EPTC 2017

Y2 - 6 December 2017 through 9 December 2017

ER -

Kim J, Lee B, Koo JM, Gan CL. Copper nanoparticle paste on different metallic substrates for low temperature bonded interconnection. In 2017 IEEE 19th Electronics Packaging Technology Conference, EPTC 2017. Institute of Electrical and Electronics Engineers Inc. 2017. p. 1-4. (2017 IEEE 19th Electronics Packaging Technology Conference, EPTC 2017). doi: 10.1109/EPTC.2017.8277556

Copper nanoparticle paste on different metallic substrates for low temperature bonded interconnection

Abstract

Publication series

Conference

Bibliographical note

ASJC Scopus Subject Areas

Access to Document

Other files and links

Fingerprint

Cite this