Customized glass sealant for ceramic substrates for high temperature electronic application

Ahmed Sharif; Chee Lip Gan; Zhong Chen

doi:10.1016/j.microrel.2014.07.005

Customized glass sealant for ceramic substrates for high temperature electronic application

Ahmed Sharif^*, Chee Lip Gan, Zhong Chen

^*Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

16 Citations (Scopus)

Abstract

This study investigates the ceramic to ceramic bonding, using composite glass frit as the binding layer that is able to tolerate a high temperature environment for ruggedized microelectronic applications. Shear strength measurements were carried out at both room and high temperature (i.e. 250 °C) to evaluate room and high temperature performance of the joints. The glass joints in both the Al₂O₃/glass/Al₂O₃ and AlN/glass/AlN systems maintained their integrity even when shear-tested at 250°C. The results of the mechanical and microstructural characterizations demonstrate that Bi-based two phase glass frit bonding is an effective ceramic bonding method for harsh-environment electronic packaging.

Original language	English
Pages (from-to)	2905-2910
Number of pages	6
Journal	Microelectronics Reliability
Volume	54
Issue number	12
DOIs	https://doi.org/10.1016/j.microrel.2014.07.005
Publication status	Published - Dec 1 2014
Externally published	Yes

Bibliographical note

Publisher Copyright:
© 2014 Elsevier Ltd. All rights reserved.

ASJC Scopus Subject Areas

Electronic, Optical and Magnetic Materials
Atomic and Molecular Physics, and Optics
Safety, Risk, Reliability and Quality
Condensed Matter Physics
Surfaces, Coatings and Films
Electrical and Electronic Engineering

Keywords

Ceramic substrates
Electronics packaging
Harsh environment
High-temperature reliability
Pb-free glass frit

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10.1016/j.microrel.2014.07.005

Cite this

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title = "Customized glass sealant for ceramic substrates for high temperature electronic application",

abstract = "This study investigates the ceramic to ceramic bonding, using composite glass frit as the binding layer that is able to tolerate a high temperature environment for ruggedized microelectronic applications. Shear strength measurements were carried out at both room and high temperature (i.e. 250 °C) to evaluate room and high temperature performance of the joints. The glass joints in both the Al2O3/glass/Al2O3 and AlN/glass/AlN systems maintained their integrity even when shear-tested at 250°C. The results of the mechanical and microstructural characterizations demonstrate that Bi-based two phase glass frit bonding is an effective ceramic bonding method for harsh-environment electronic packaging.",

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author = "Ahmed Sharif and Gan, {Chee Lip} and Zhong Chen",

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T1 - Customized glass sealant for ceramic substrates for high temperature electronic application

AU - Sharif, Ahmed

AU - Gan, Chee Lip

AU - Chen, Zhong

PY - 2014/12/1

Y1 - 2014/12/1

N2 - This study investigates the ceramic to ceramic bonding, using composite glass frit as the binding layer that is able to tolerate a high temperature environment for ruggedized microelectronic applications. Shear strength measurements were carried out at both room and high temperature (i.e. 250 °C) to evaluate room and high temperature performance of the joints. The glass joints in both the Al2O3/glass/Al2O3 and AlN/glass/AlN systems maintained their integrity even when shear-tested at 250°C. The results of the mechanical and microstructural characterizations demonstrate that Bi-based two phase glass frit bonding is an effective ceramic bonding method for harsh-environment electronic packaging.

AB - This study investigates the ceramic to ceramic bonding, using composite glass frit as the binding layer that is able to tolerate a high temperature environment for ruggedized microelectronic applications. Shear strength measurements were carried out at both room and high temperature (i.e. 250 °C) to evaluate room and high temperature performance of the joints. The glass joints in both the Al2O3/glass/Al2O3 and AlN/glass/AlN systems maintained their integrity even when shear-tested at 250°C. The results of the mechanical and microstructural characterizations demonstrate that Bi-based two phase glass frit bonding is an effective ceramic bonding method for harsh-environment electronic packaging.

KW - Ceramic substrates

KW - Electronics packaging

KW - Harsh environment

KW - High-temperature reliability

KW - Pb-free glass frit

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JF - Microelectronics Reliability

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ER -

Customized glass sealant for ceramic substrates for high temperature electronic application

Abstract

Bibliographical note

ASJC Scopus Subject Areas

Keywords

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