Customized glass sealant for ceramic substrates for high temperature electronic application

Keyphrases

• Glass Sealant 100%
• Ceramic Bond 100%
• High Temperature Electronics 100%
• Ceramic Substrate 100%
• Glass Frit 50%
• Glass Frit Bonding 50%
• Shear Strength Test 50%
• Bonding Process 50%
• Electronic Packaging 50%
• Microelectronics Applications 50%
• Harsh Environment Electronics 50%
• Composite Glass 50%
• High-temperature Performance 50%
• Bi-based 50%
• Mechanical Characterization 50%
• Binding Layer 50%
• Room Temperature Performance 50%
• Ruggedized 50%

Engineering

• Electronic Packaging 50%
• Glass Frit Bonding 50%
• Glass Frit 50%

Material Science

• Ceramic Substrate 100%