Cyanate ester-based encapsulation material for high-temperature applications

Cyanate ester resin-based composite materials have been proposed as potential encapsulants for high-temperature applications. The objective of this study is to develop a cyanate ester-based encapsulant, which can also serve as a flip-chip underfill as well as for traditional encapsulation. Two different materials, quartz and alumina fillers, have been studied. The impact of shapes and sizes of the fillers on the overall thermomechanical properties has been investigated. The adhesion strengths of the materials to the ceramic substrate, Kovar lid, and silicon die have also been characterized. The modulus of the resin and the shape of the fillers play a pivotal role in minimizing thermal stress, generated by coefficient of thermal expansion mismatches. Smaller filler particles were found to have better adhesion to the cyanate ester resin. The high-temperature performance of the cyanate ester-based encapsulants was evaluated by thermal aging at 300 C for up to 500 h.