Decapsulation of 3D multi-die stacked package

H. B. Kor; Q. Liu; Y. W. Siah; C. L. Gan

doi:10.1109/IPFA.2015.7224433

Decapsulation of 3D multi-die stacked package

H. B. Kor, Q. Liu, Y. W. Siah, C. L. Gan

Nanyang Technological University

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

1 Citation (Scopus)

Abstract

Although a combination of laser, mechanical and chemical techniques can be used to expose a very large and thin die from a multi-die stacked package, package warping and die crack occur in the process of gaining access to each die. The aim of this paper is to investigate the sample preparation technique to access each individual die from a four-die stacked package, while maintaining the structural integrity of each die for further failure analysis.

Original language	English
Title of host publication	Proceedings of the 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2015
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	465-468
Number of pages	4
ISBN (Electronic)	9781479999286, 9781479999286
DOIs	https://doi.org/10.1109/IPFA.2015.7224433
Publication status	Published - Aug 25 2015
Externally published	Yes
Event	22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2015 - Hsinchu, Taiwan, Province of China Duration: Jun 29 2015 → Jul 2 2015

Publication series

Name	Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA
Volume	2015-August

Conference

Conference	22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2015
Country/Territory	Taiwan, Province of China
City	Hsinchu
Period	6/29/15 → 7/2/15

Bibliographical note

Publisher Copyright:
© 2015 IEEE.

ASJC Scopus Subject Areas

Electrical and Electronic Engineering

Access to Document

10.1109/IPFA.2015.7224433

Cite this

Kor, H. B., Liu, Q., Siah, Y. W., & Gan, C. L. (2015). Decapsulation of 3D multi-die stacked package. In Proceedings of the 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2015 (pp. 465-468). Article 7224433 (Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA; Vol. 2015-August). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/IPFA.2015.7224433

Kor, H. B. ; Liu, Q. ; Siah, Y. W. et al. / Decapsulation of 3D multi-die stacked package. Proceedings of the 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2015. Institute of Electrical and Electronics Engineers Inc., 2015. pp. 465-468 (Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA).

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title = "Decapsulation of 3D multi-die stacked package",

abstract = "Although a combination of laser, mechanical and chemical techniques can be used to expose a very large and thin die from a multi-die stacked package, package warping and die crack occur in the process of gaining access to each die. The aim of this paper is to investigate the sample preparation technique to access each individual die from a four-die stacked package, while maintaining the structural integrity of each die for further failure analysis.",

author = "Kor, {H. B.} and Q. Liu and Siah, {Y. W.} and Gan, {C. L.}",

note = "Publisher Copyright: {\textcopyright} 2015 IEEE.; 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2015 ; Conference date: 29-06-2015 Through 02-07-2015",

year = "2015",

month = aug,

day = "25",

doi = "10.1109/IPFA.2015.7224433",

language = "English",

series = "Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA",

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Kor, HB, Liu, Q, Siah, YW & Gan, CL 2015, Decapsulation of 3D multi-die stacked package. in Proceedings of the 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2015., 7224433, Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA, vol. 2015-August, Institute of Electrical and Electronics Engineers Inc., pp. 465-468, 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2015, Hsinchu, Taiwan, Province of China, 6/29/15. https://doi.org/10.1109/IPFA.2015.7224433

Decapsulation of 3D multi-die stacked package. / Kor, H. B.; Liu, Q.; Siah, Y. W. et al.
Proceedings of the 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2015. Institute of Electrical and Electronics Engineers Inc., 2015. p. 465-468 7224433 (Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA; Vol. 2015-August).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

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PY - 2015/8/25

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N2 - Although a combination of laser, mechanical and chemical techniques can be used to expose a very large and thin die from a multi-die stacked package, package warping and die crack occur in the process of gaining access to each die. The aim of this paper is to investigate the sample preparation technique to access each individual die from a four-die stacked package, while maintaining the structural integrity of each die for further failure analysis.

AB - Although a combination of laser, mechanical and chemical techniques can be used to expose a very large and thin die from a multi-die stacked package, package warping and die crack occur in the process of gaining access to each die. The aim of this paper is to investigate the sample preparation technique to access each individual die from a four-die stacked package, while maintaining the structural integrity of each die for further failure analysis.

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Kor HB, Liu Q, Siah YW, Gan CL. Decapsulation of 3D multi-die stacked package. In Proceedings of the 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2015. Institute of Electrical and Electronics Engineers Inc. 2015. p. 465-468. 7224433. (Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA). doi: 10.1109/IPFA.2015.7224433

Decapsulation of 3D multi-die stacked package

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