Descrambling of embedded SRAM using a laser probe

S. Chef; C. T. Chua; J. Y. Tay; Y. W. Siah; S. Bhasin; J. Breier; C. L. Gan

doi:10.1109/IPFA.2018.8452604

Descrambling of embedded SRAM using a laser probe

S. Chef, C. T. Chua, J. Y. Tay, Y. W. Siah, S. Bhasin, J. Breier, C. L. Gan

Nanyang Technological University

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

8 Citations (Scopus)

Abstract

Understanding the organization of memory is a mandatory first step in various fields of applications such as failure analysis, defect localization, qualification and testing of space electronics, and security evaluation. For the last category, localization of specific addresses may be used for content estimation or encryption key recovery, with several techniques being reported for this task. In this paper, we discuss the application of laser probing for descrambling memory embedded in 8 bits microcontrollers designed and manufactured by different companies in various technology nodes.

Original language	English
Title of host publication	IPFA 2018 - 25th International Symposium on the Physical and Failure Analysis of Integrated Circuits
Publisher	Institute of Electrical and Electronics Engineers Inc.
ISBN (Print)	9781538649299
DOIs	https://doi.org/10.1109/IPFA.2018.8452604
Publication status	Published - Aug 30 2018
Externally published	Yes
Event	25th International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2018 - Singapore, Singapore Duration: Jul 16 2018 → Jul 19 2018

Publication series

Name	Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA
Volume	2018-July

Conference

Conference	25th International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2018
Country/Territory	Singapore
City	Singapore
Period	7/16/18 → 7/19/18

Bibliographical note

Publisher Copyright:
© 2018 IEEE.

ASJC Scopus Subject Areas

Electrical and Electronic Engineering

Keywords

8 bits Microcontrollers
Descrambling
Laser probing
SRAM

Access to Document

10.1109/IPFA.2018.8452604

Cite this

Chef, S., Chua, C. T., Tay, J. Y., Siah, Y. W., Bhasin, S., Breier, J., & Gan, C. L. (2018). Descrambling of embedded SRAM using a laser probe. In IPFA 2018 - 25th International Symposium on the Physical and Failure Analysis of Integrated Circuits Article 8452604 (Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA; Vol. 2018-July). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/IPFA.2018.8452604

Chef, S. ; Chua, C. T. ; Tay, J. Y. et al. / Descrambling of embedded SRAM using a laser probe. IPFA 2018 - 25th International Symposium on the Physical and Failure Analysis of Integrated Circuits. Institute of Electrical and Electronics Engineers Inc., 2018. (Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA).

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keywords = "8 bits Microcontrollers, Descrambling, Laser probing, SRAM",

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Chef, S, Chua, CT, Tay, JY, Siah, YW, Bhasin, S, Breier, J & Gan, CL 2018, Descrambling of embedded SRAM using a laser probe. in IPFA 2018 - 25th International Symposium on the Physical and Failure Analysis of Integrated Circuits., 8452604, Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA, vol. 2018-July, Institute of Electrical and Electronics Engineers Inc., 25th International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2018, Singapore, Singapore, 7/16/18. https://doi.org/10.1109/IPFA.2018.8452604

Descrambling of embedded SRAM using a laser probe. / Chef, S.; Chua, C. T.; Tay, J. Y. et al.
IPFA 2018 - 25th International Symposium on the Physical and Failure Analysis of Integrated Circuits. Institute of Electrical and Electronics Engineers Inc., 2018. 8452604 (Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA; Vol. 2018-July).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

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Chef S, Chua CT, Tay JY, Siah YW, Bhasin S, Breier J et al. Descrambling of embedded SRAM using a laser probe. In IPFA 2018 - 25th International Symposium on the Physical and Failure Analysis of Integrated Circuits. Institute of Electrical and Electronics Engineers Inc. 2018. 8452604. (Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA). doi: 10.1109/IPFA.2018.8452604

Descrambling of embedded SRAM using a laser probe

Abstract

Publication series

Conference

Bibliographical note

ASJC Scopus Subject Areas

Keywords

Access to Document

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