Development of ruggedized timer and temperature sensor packaging for 300°C/30kpsi downhole environment

Hwang How Yuan; Haridas Kuruveettil; Eva Wai Leong Ching; Eric Phua Jian Rong; Gan Chee Lip; Daniel Rhee Min Woo

doi:10.1109/EPTC.2014.7028366

Development of ruggedized timer and temperature sensor packaging for 300°C/30kpsi downhole environment

Hwang How Yuan, Haridas Kuruveettil, Eva Wai Leong Ching, Eric Phua Jian Rong, Gan Chee Lip, Daniel Rhee Min Woo

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

3 Citations (Scopus)

Abstract

While the advantages of high temperature electronics in the form of hermetic ceramic packaging are numerous, their deployments are being limited by the maximum environmental pressure. Literature [1] has shown that to withstand 30kpsi pressure for instance, a flat ceramic lid of at least 3mm will be required for a cavity size of 10.16mm × 10.16mm. Lid thickness will have to increase if the cavity size is increased. However, by filling the cavity with high temperature endurable material, thickness requirement can be eliminated from consideration, maintaining low package profile [2]. The approach has been demonstrated through a timer / temperature sensor circuitry embedded in a 31.75mm × 10.92mm cavity and successfully passed a combined HPHT of 30kpsi and 300°C until the end of targeted 200 hours.

Original language	English
Title of host publication	Proceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	606-610
Number of pages	5
ISBN (Electronic)	9781479969944
DOIs	https://doi.org/10.1109/EPTC.2014.7028366
Publication status	Published - Jan 30 2014
Externally published	Yes
Event	2014 16th IEEE Electronics Packaging Technology Conference, EPTC 2014 - Singapore, Singapore Duration: Dec 3 2014 → Dec 5 2014

Publication series

Name	Proceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014

Conference

Conference	2014 16th IEEE Electronics Packaging Technology Conference, EPTC 2014
Country/Territory	Singapore
City	Singapore
Period	12/3/14 → 12/5/14

Bibliographical note

Publisher Copyright:
© 2014 IEEE.

ASJC Scopus Subject Areas

Electrical and Electronic Engineering

Access to Document

10.1109/EPTC.2014.7028366

Cite this

Yuan, H. H., Kuruveettil, H., Ching, E. W. L., Rong, E. P. J., Lip, G. C., & Woo, D. R. M. (2014). Development of ruggedized timer and temperature sensor packaging for 300°C/30kpsi downhole environment. In Proceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014 (pp. 606-610). Article 7028366 (Proceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EPTC.2014.7028366

Yuan, Hwang How ; Kuruveettil, Haridas ; Ching, Eva Wai Leong et al. / Development of ruggedized timer and temperature sensor packaging for 300°C/30kpsi downhole environment. Proceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014. Institute of Electrical and Electronics Engineers Inc., 2014. pp. 606-610 (Proceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014).

@inproceedings{277d106149b3440b9c3ed359a0ddfa52,

title = "Development of ruggedized timer and temperature sensor packaging for 300°C/30kpsi downhole environment",

abstract = "While the advantages of high temperature electronics in the form of hermetic ceramic packaging are numerous, their deployments are being limited by the maximum environmental pressure. Literature [1] has shown that to withstand 30kpsi pressure for instance, a flat ceramic lid of at least 3mm will be required for a cavity size of 10.16mm × 10.16mm. Lid thickness will have to increase if the cavity size is increased. However, by filling the cavity with high temperature endurable material, thickness requirement can be eliminated from consideration, maintaining low package profile [2]. The approach has been demonstrated through a timer / temperature sensor circuitry embedded in a 31.75mm × 10.92mm cavity and successfully passed a combined HPHT of 30kpsi and 300°C until the end of targeted 200 hours.",

author = "Yuan, \{Hwang How\} and Haridas Kuruveettil and Ching, \{Eva Wai Leong\} and Rong, \{Eric Phua Jian\} and Lip, \{Gan Chee\} and Woo, \{Daniel Rhee Min\}",

note = "Publisher Copyright: {\textcopyright} 2014 IEEE.; 2014 16th IEEE Electronics Packaging Technology Conference, EPTC 2014 ; Conference date: 03-12-2014 Through 05-12-2014",

year = "2014",

month = jan,

day = "30",

doi = "10.1109/EPTC.2014.7028366",

language = "English",

series = "Proceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

pages = "606--610",

booktitle = "Proceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014",

address = "United States",

}

Yuan, HH, Kuruveettil, H, Ching, EWL, Rong, EPJ, Lip, GC & Woo, DRM 2014, Development of ruggedized timer and temperature sensor packaging for 300°C/30kpsi downhole environment. in Proceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014., 7028366, Proceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014, Institute of Electrical and Electronics Engineers Inc., pp. 606-610, 2014 16th IEEE Electronics Packaging Technology Conference, EPTC 2014, Singapore, Singapore, 12/3/14. https://doi.org/10.1109/EPTC.2014.7028366

Development of ruggedized timer and temperature sensor packaging for 300°C/30kpsi downhole environment. / Yuan, Hwang How; Kuruveettil, Haridas; Ching, Eva Wai Leong et al.
Proceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014. Institute of Electrical and Electronics Engineers Inc., 2014. p. 606-610 7028366 (Proceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

TY - GEN

T1 - Development of ruggedized timer and temperature sensor packaging for 300°C/30kpsi downhole environment

AU - Yuan, Hwang How

AU - Kuruveettil, Haridas

AU - Ching, Eva Wai Leong

AU - Rong, Eric Phua Jian

AU - Lip, Gan Chee

AU - Woo, Daniel Rhee Min

PY - 2014/1/30

Y1 - 2014/1/30

N2 - While the advantages of high temperature electronics in the form of hermetic ceramic packaging are numerous, their deployments are being limited by the maximum environmental pressure. Literature [1] has shown that to withstand 30kpsi pressure for instance, a flat ceramic lid of at least 3mm will be required for a cavity size of 10.16mm × 10.16mm. Lid thickness will have to increase if the cavity size is increased. However, by filling the cavity with high temperature endurable material, thickness requirement can be eliminated from consideration, maintaining low package profile [2]. The approach has been demonstrated through a timer / temperature sensor circuitry embedded in a 31.75mm × 10.92mm cavity and successfully passed a combined HPHT of 30kpsi and 300°C until the end of targeted 200 hours.

AB - While the advantages of high temperature electronics in the form of hermetic ceramic packaging are numerous, their deployments are being limited by the maximum environmental pressure. Literature [1] has shown that to withstand 30kpsi pressure for instance, a flat ceramic lid of at least 3mm will be required for a cavity size of 10.16mm × 10.16mm. Lid thickness will have to increase if the cavity size is increased. However, by filling the cavity with high temperature endurable material, thickness requirement can be eliminated from consideration, maintaining low package profile [2]. The approach has been demonstrated through a timer / temperature sensor circuitry embedded in a 31.75mm × 10.92mm cavity and successfully passed a combined HPHT of 30kpsi and 300°C until the end of targeted 200 hours.

UR - http://www.scopus.com/inward/record.url?scp=84946689887&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84946689887&partnerID=8YFLogxK

U2 - 10.1109/EPTC.2014.7028366

DO - 10.1109/EPTC.2014.7028366

M3 - Conference contribution

AN - SCOPUS:84946689887

T3 - Proceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014

SP - 606

EP - 610

BT - Proceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 2014 16th IEEE Electronics Packaging Technology Conference, EPTC 2014

Y2 - 3 December 2014 through 5 December 2014

ER -

Yuan HH, Kuruveettil H, Ching EWL, Rong EPJ, Lip GC, Woo DRM. Development of ruggedized timer and temperature sensor packaging for 300°C/30kpsi downhole environment. In Proceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014. Institute of Electrical and Electronics Engineers Inc. 2014. p. 606-610. 7028366. (Proceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014). doi: 10.1109/EPTC.2014.7028366

Development of ruggedized timer and temperature sensor packaging for 300°C/30kpsi downhole environment

Abstract

Publication series

Conference

Bibliographical note

ASJC Scopus Subject Areas

Access to Document

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Cite this