Fingerprint
Dive into the research topics of 'Effect of current crowding on copper dual damascene via bottom failure for ULSI applications'. Together they form a unique fingerprint.- Sort by
- Weight
- Alphabetically
Effect of current crowding on copper dual damascene via bottom failure for ULSI applications
R. Arijit*, C. M. Tan, V. V. Anand, K. Ahila, G. Zhang, M. G. Subodh
*Corresponding author for this work
Research output: Contribution to conference › Paper › peer-review
1
Citation
(Scopus)