Effect of current distribution on the reliability of multi-terminal Cu dual-damascene interconnect trees

Chee Lip Gan; Carl V. Thompson; Kin Leong Pey; Wee Kiong Choi; Choon Wai Chang; Qiang Guo

Effect of current distribution on the reliability of multi-terminal Cu dual-damascene interconnect trees

Chee Lip Gan^*, Carl V. Thompson, Kin Leong Pey, Wee Kiong Choi, Choon Wai Chang, Qiang Guo

^*Corresponding author for this work

Research output: Contribution to journal › Conference article › peer-review

Abstract

While the reliability of a dual-damascene via is independent of the number of segments connected to it, it is strongly dependent on the distribution of current among the segments. The most highly stressed segments are not always the least reliable. This behavior for Cu is different than for A1.

Original language	English
Pages (from-to)	594-595
Number of pages	2
Journal	Annual Proceedings - Reliability Physics (Symposium)
Publication status	Published - 2003
Externally published	Yes
Event	2003 IEEE International Reliability Physics Symposium Proceedings - Dallas, TX, United States Duration: Mar 30 2003 → Apr 4 2003

ASJC Scopus Subject Areas

Electrical and Electronic Engineering
Safety, Risk, Reliability and Quality

Keywords

Copper metallization
Electromigration
Interconnect tree
Reliability

Cite this

@article{12eeeae9a1534360bf998f43df3a897b,

title = "Effect of current distribution on the reliability of multi-terminal Cu dual-damascene interconnect trees",

abstract = "While the reliability of a dual-damascene via is independent of the number of segments connected to it, it is strongly dependent on the distribution of current among the segments. The most highly stressed segments are not always the least reliable. This behavior for Cu is different than for A1.",

keywords = "Copper metallization, Electromigration, Interconnect tree, Reliability",

author = "Gan, {Chee Lip} and Thompson, {Carl V.} and Pey, {Kin Leong} and Choi, {Wee Kiong} and Chang, {Choon Wai} and Qiang Guo",

year = "2003",

language = "English",

pages = "594--595",

journal = "Annual Proceedings - Reliability Physics (Symposium)",

issn = "0099-9512",

note = "2003 IEEE International Reliability Physics Symposium Proceedings ; Conference date: 30-03-2003 Through 04-04-2003",

}

TY - JOUR

T1 - Effect of current distribution on the reliability of multi-terminal Cu dual-damascene interconnect trees

AU - Gan, Chee Lip

AU - Thompson, Carl V.

AU - Pey, Kin Leong

AU - Choi, Wee Kiong

AU - Chang, Choon Wai

AU - Guo, Qiang

PY - 2003

Y1 - 2003

N2 - While the reliability of a dual-damascene via is independent of the number of segments connected to it, it is strongly dependent on the distribution of current among the segments. The most highly stressed segments are not always the least reliable. This behavior for Cu is different than for A1.

AB - While the reliability of a dual-damascene via is independent of the number of segments connected to it, it is strongly dependent on the distribution of current among the segments. The most highly stressed segments are not always the least reliable. This behavior for Cu is different than for A1.

KW - Copper metallization

KW - Electromigration

KW - Interconnect tree

KW - Reliability

UR - http://www.scopus.com/inward/record.url?scp=0038648898&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0038648898&partnerID=8YFLogxK

M3 - Conference article

AN - SCOPUS:0038648898

SN - 0099-9512

SP - 594

EP - 595

JO - Annual Proceedings - Reliability Physics (Symposium)

JF - Annual Proceedings - Reliability Physics (Symposium)

T2 - 2003 IEEE International Reliability Physics Symposium Proceedings

Y2 - 30 March 2003 through 4 April 2003

ER -

Effect of current distribution on the reliability of multi-terminal Cu dual-damascene interconnect trees

Abstract

ASJC Scopus Subject Areas

Keywords

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