Abstract
This paper describes the curing, processing and thermomechanical behaviours of a anhydride-cured liquid epoxy based underfill polymer that was contaminated with water. Water was added to the uncured underfill system using two different routes simulating two possible ways in which the underfill resin can be contaminated. In the first case known amounts of water was added directly to a fully-formulated underfill, whilst in the second case, water was added to the epoxy resin prior to formulating the underfill system. The effects of the added water were studied using Fouirer Transform Infrared (FTIR), differential scaaning calorimetry (DSC), dynamic mechanical analyser (DMA) and light microscopy. This study shows that the presence of water resulted in the rapid hydrolysis of the anhydride hardener to form solid crystalline carboxylic acid. It was found that the major cause of the flow disturbances during underfilling and deterioration in the final properties of the underfill was closely related to the occurences of these carboxylic acid. Direct contamination of the formulated underfill was found to have the greatest impact on the material processing and thermomechanical properties.
Original language | English |
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Title of host publication | International Symposium on Electronic Materials and Packaging, EMAP 2000 |
Publisher | Institute of Electrical and Electronics Engineers Inc. |
Pages | 289-296 |
Number of pages | 8 |
ISBN (Electronic) | 0780366549, 9780780366541 |
DOIs | |
Publication status | Published - 2000 |
Externally published | Yes |
Event | International Symposium on Electronic Materials and Packaging, EMAP 2000 - Hong Kong, China Duration: Nov 30 2000 → Dec 2 2000 |
Publication series
Name | International Symposium on Electronic Materials and Packaging, EMAP 2000 |
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Conference
Conference | International Symposium on Electronic Materials and Packaging, EMAP 2000 |
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Country/Territory | China |
City | Hong Kong |
Period | 11/30/00 → 12/2/00 |
Bibliographical note
Publisher Copyright:© 2000 IEEE.
ASJC Scopus Subject Areas
- General Engineering