Effect of moisture on the curing behaviour of underfills

K. S. Chian, S. H. Lim, S. Yi, William T. Chen

Research output: Chapter in Book/Report/Conference proceedingConference contribution

7 Citations (Scopus)

Abstract

This paper describes the curing, processing and thermomechanical behaviours of a anhydride-cured liquid epoxy based underfill polymer that was contaminated with water. Water was added to the uncured underfill system using two different routes simulating two possible ways in which the underfill resin can be contaminated. In the first case known amounts of water was added directly to a fully-formulated underfill, whilst in the second case, water was added to the epoxy resin prior to formulating the underfill system. The effects of the added water were studied using Fouirer Transform Infrared (FTIR), differential scaaning calorimetry (DSC), dynamic mechanical analyser (DMA) and light microscopy. This study shows that the presence of water resulted in the rapid hydrolysis of the anhydride hardener to form solid crystalline carboxylic acid. It was found that the major cause of the flow disturbances during underfilling and deterioration in the final properties of the underfill was closely related to the occurences of these carboxylic acid. Direct contamination of the formulated underfill was found to have the greatest impact on the material processing and thermomechanical properties.

Original languageEnglish
Title of host publicationInternational Symposium on Electronic Materials and Packaging, EMAP 2000
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages289-296
Number of pages8
ISBN (Electronic)0780366549, 9780780366541
DOIs
Publication statusPublished - 2000
Externally publishedYes
EventInternational Symposium on Electronic Materials and Packaging, EMAP 2000 - Hong Kong, China
Duration: Nov 30 2000Dec 2 2000

Publication series

NameInternational Symposium on Electronic Materials and Packaging, EMAP 2000

Conference

ConferenceInternational Symposium on Electronic Materials and Packaging, EMAP 2000
Country/TerritoryChina
CityHong Kong
Period11/30/0012/2/00

Bibliographical note

Publisher Copyright:
© 2000 IEEE.

ASJC Scopus Subject Areas

  • General Engineering

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