Effect of package construction on thermal performance of plastic IC packages

Navin Bhandarkar; Subodh Mhaisalkar; Pauline Lee; Daniel Tracy

Effect of package construction on thermal performance of plastic IC packages

Navin Bhandarkar^*, Subodh Mhaisalkar, Pauline Lee, Daniel Tracy

^*Corresponding author for this work

Singapore Pte Ltd

Research output: Contribution to conference › Paper › peer-review

6 Citations (Scopus)

Abstract

This paper explores the effect of package geometry and material on the junction to ambient thermal resistance (θja) of plastic IC packages. Only internal package geometry changes are explored here for packages operating under still-air ambient conditions. Among the factors explored in this paper are drop-in heatspreaders, high thermal conductivity mold compounds and die-attach epoxies, as well as the effect of die-attach delamination. Forced convection and external heatsinks are not studied here as they can form an extensive topic of study on their own.

Original language	English
Pages	65-68
Number of pages	4
Publication status	Published - 1997
Externally published	Yes
Event	Proceedings of the 1997 1st Electronic Packaging Technology Conference, EPTC - Singapore, Singapore Duration: Oct 8 1997 → Oct 10 1997

Conference

Conference	Proceedings of the 1997 1st Electronic Packaging Technology Conference, EPTC
City	Singapore, Singapore
Period	10/8/97 → 10/10/97

ASJC Scopus Subject Areas

General Engineering

Cite this

@conference{c6f2afd0e844443eb30f23958e912d92,

title = "Effect of package construction on thermal performance of plastic IC packages",

abstract = "This paper explores the effect of package geometry and material on the junction to ambient thermal resistance (θja) of plastic IC packages. Only internal package geometry changes are explored here for packages operating under still-air ambient conditions. Among the factors explored in this paper are drop-in heatspreaders, high thermal conductivity mold compounds and die-attach epoxies, as well as the effect of die-attach delamination. Forced convection and external heatsinks are not studied here as they can form an extensive topic of study on their own.",

author = "Navin Bhandarkar and Subodh Mhaisalkar and Pauline Lee and Daniel Tracy",

year = "1997",

language = "English",

pages = "65--68",

note = "Proceedings of the 1997 1st Electronic Packaging Technology Conference, EPTC ; Conference date: 08-10-1997 Through 10-10-1997",

}

TY - CONF

T1 - Effect of package construction on thermal performance of plastic IC packages

AU - Bhandarkar, Navin

AU - Mhaisalkar, Subodh

AU - Lee, Pauline

AU - Tracy, Daniel

PY - 1997

Y1 - 1997

N2 - This paper explores the effect of package geometry and material on the junction to ambient thermal resistance (θja) of plastic IC packages. Only internal package geometry changes are explored here for packages operating under still-air ambient conditions. Among the factors explored in this paper are drop-in heatspreaders, high thermal conductivity mold compounds and die-attach epoxies, as well as the effect of die-attach delamination. Forced convection and external heatsinks are not studied here as they can form an extensive topic of study on their own.

AB - This paper explores the effect of package geometry and material on the junction to ambient thermal resistance (θja) of plastic IC packages. Only internal package geometry changes are explored here for packages operating under still-air ambient conditions. Among the factors explored in this paper are drop-in heatspreaders, high thermal conductivity mold compounds and die-attach epoxies, as well as the effect of die-attach delamination. Forced convection and external heatsinks are not studied here as they can form an extensive topic of study on their own.

UR - http://www.scopus.com/inward/record.url?scp=0031313534&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0031313534&partnerID=8YFLogxK

M3 - Paper

AN - SCOPUS:0031313534

SP - 65

EP - 68

T2 - Proceedings of the 1997 1st Electronic Packaging Technology Conference, EPTC

Y2 - 8 October 1997 through 10 October 1997

ER -

Effect of package construction on thermal performance of plastic IC packages

Abstract

Conference

ASJC Scopus Subject Areas

Other files and links

Fingerprint

Cite this