TY - GEN
T1 - Effect of palladium on the mechanical properties of Cu and Cu-Al intermetallic compounds
AU - Lim, Adeline B.Y.
AU - Long, Xin
AU - Shen, Lu
AU - Chen, Xi
AU - Ramanujan, Raju
AU - Gan, Chee Lip
AU - Chen, Zhong
PY - 2013
Y1 - 2013
N2 - There is a growing interest in copper (Cu) wire bonding due to its significant cost savings over gold wire. However, concerns on package reliability and corrosion susceptibility have driven the industry to develop alternative materials. Recently, palladium coated copper wire (Pd-Cu) wire has seen rapid entry into the market as it is believed to improve reliability of copper wire bonds on aluminum (Al) pads. However, the effect of palladium on the mechanical properties and corrosion resistance of Cu and Cu-Al intermetallics has not been studied in detail. In this paper, bulk alloys of Cu and Cu-Al with different concentrations of Pd were prepared under controlled conditions to simulate the intermetallics (IMC) formed between the copper ball bond and aluminum pads during bonding. Material properties such as elemental composition and phase formation were analyzed. Hardness and Young's modulus of the alloys were characterized by nanoindentation. It was observed that CuAl intermetallic is the hardest and stiffest. Palladium was observed to slightly increase the modulus and hardness of the alloys.
AB - There is a growing interest in copper (Cu) wire bonding due to its significant cost savings over gold wire. However, concerns on package reliability and corrosion susceptibility have driven the industry to develop alternative materials. Recently, palladium coated copper wire (Pd-Cu) wire has seen rapid entry into the market as it is believed to improve reliability of copper wire bonds on aluminum (Al) pads. However, the effect of palladium on the mechanical properties and corrosion resistance of Cu and Cu-Al intermetallics has not been studied in detail. In this paper, bulk alloys of Cu and Cu-Al with different concentrations of Pd were prepared under controlled conditions to simulate the intermetallics (IMC) formed between the copper ball bond and aluminum pads during bonding. Material properties such as elemental composition and phase formation were analyzed. Hardness and Young's modulus of the alloys were characterized by nanoindentation. It was observed that CuAl intermetallic is the hardest and stiffest. Palladium was observed to slightly increase the modulus and hardness of the alloys.
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U2 - 10.1109/EPTC.2013.6745727
DO - 10.1109/EPTC.2013.6745727
M3 - Conference contribution
AN - SCOPUS:84897787977
SN - 9781479928330
T3 - Proceedings of the 2013 IEEE 15th Electronics Packaging Technology Conference, EPTC 2013
SP - 276
EP - 281
BT - Proceedings of the 2013 IEEE 15th Electronics Packaging Technology Conference, EPTC 2013
T2 - 2013 IEEE 15th Electronics Packaging Technology Conference, EPTC 2013
Y2 - 11 December 2013 through 13 December 2013
ER -