TY - GEN
T1 - Effect of temperature and bonding duration on the mechanical strength of metal-to-metal thermocompression bonds
AU - Made, Riko I.
AU - Gan, Chee Lip
AU - Yan, Liling
PY - 2009
Y1 - 2009
N2 - An analytical model is proposed which relates the bonding temperature and bonding duration to the integrity of metal-metal thermo-compression bonds. Based on the assumption of vacancy diffusion mechanism, the bonded area is calculated as a function of the bonding temperature, bonding time and the true contact area. Meanwhile, the true contact area is calculated as a function of the applied load and surface roughness. Experimental verification of the model was carried out on Cu-Cu thermo-compression bonds of Cu-coated silicon wafer with chemical-mechanical polish finished surfaces, which was diced into 2.5 mm squares. The samples were bonded at a range of temperatures and shear strength measurements were used to characterize the effects of bonding parameters to the interface bond strength. The results correlate well with the trends predicted by the model on the effects of temperature and bonding duration to the bond integrity in the thermo-compression bond process.
AB - An analytical model is proposed which relates the bonding temperature and bonding duration to the integrity of metal-metal thermo-compression bonds. Based on the assumption of vacancy diffusion mechanism, the bonded area is calculated as a function of the bonding temperature, bonding time and the true contact area. Meanwhile, the true contact area is calculated as a function of the applied load and surface roughness. Experimental verification of the model was carried out on Cu-Cu thermo-compression bonds of Cu-coated silicon wafer with chemical-mechanical polish finished surfaces, which was diced into 2.5 mm squares. The samples were bonded at a range of temperatures and shear strength measurements were used to characterize the effects of bonding parameters to the interface bond strength. The results correlate well with the trends predicted by the model on the effects of temperature and bonding duration to the bond integrity in the thermo-compression bond process.
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M3 - Conference contribution
AN - SCOPUS:70449572698
SN - 9781605110844
T3 - Materials Research Society Symposium Proceedings
SP - 101
EP - 106
BT - Materials Research Society Symposium Proceedings - Materials and Technologies for 3-D Integration
T2 - Materials and Technologies for 3-D Integration - 2008 MRS Fall Meeting
Y2 - 1 December 2008 through 3 December 2008
ER -