Effects of anisotropic conductive adhesive (ACA) material properties on package reliability performance [flip-chip interconnects]

M. Teo; S. G. Mhaisalkar; E. H. Wong; Poi Siong Teo; C. C. Wong; K. Ong; Chin Foo Goh

doi:10.1109/EPTC.2003.1271612

Effects of anisotropic conductive adhesive (ACA) material properties on package reliability performance [flip-chip interconnects]

M. Teo, S. G. Mhaisalkar, E. H. Wong, Poi Siong Teo, C. C. Wong, K. Ong, Chin Foo Goh

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

15 Citations (Scopus)

Abstract

Solder alternative technologies for flip-chip interconnections are fast emerging due to the drive for environmental friendly processes. The anisotropic conductive adhesive (ACA) is one promising solder alternative candidate that shows potential for further pitch reduction. The main concern with ACA interconnection is their long-term reliability performance especially in humid environments. Although much work has been published on ACA joint behaviour, studies on correlation of material properties with reliability performance is still lacking. The main objective in this study was to identify the impact of material properties on reliability, so as to engineer highly reliable microelectronics assemblies. Four representative ACA materials (both film and paste types) with diverse properties were selected and reliability tests were carried out. Correlation analysis identified key material properties that contribute to good reliability performance. Findings indicate that the best properties for high reliability assemblies are: high adhesion strength after subjecting to reliability test conditions, low coefficient of moisture expansion and low storage modulus.

Original language	English
Title of host publication	Proceedings of 5th Electronics Packaging Technology Conference, EPTC 2003
Editors	Mahadevan K. Iyer, Yew Cheong Mui, Kok Chuan Toh
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	718-725
Number of pages	8
ISBN (Electronic)	0780382056, 9780780382053
DOIs	https://doi.org/10.1109/EPTC.2003.1271612
Publication status	Published - 2003
Externally published	Yes
Event	5th Electronics Packaging Technology Conference, EPTC 2003 - Singapore, Singapore Duration: Dec 10 2003 → Dec 12 2003

Publication series

Name	Proceedings of 5th Electronics Packaging Technology Conference, EPTC 2003

Conference

Conference	5th Electronics Packaging Technology Conference, EPTC 2003
Country/Territory	Singapore
City	Singapore
Period	12/10/03 → 12/12/03

Bibliographical note

Publisher Copyright:
© 2003 IEEE.

ASJC Scopus Subject Areas

Electrical and Electronic Engineering
Industrial and Manufacturing Engineering
Electronic, Optical and Magnetic Materials

Access to Document

10.1109/EPTC.2003.1271612

Cite this

Teo, M., Mhaisalkar, S. G., Wong, E. H., Teo, P. S., Wong, C. C., Ong, K., & Goh, C. F. (2003). Effects of anisotropic conductive adhesive (ACA) material properties on package reliability performance [flip-chip interconnects]. In M. K. Iyer, Y. C. Mui, & K. C. Toh (Eds.), Proceedings of 5th Electronics Packaging Technology Conference, EPTC 2003 (pp. 718-725). Article 1271612 (Proceedings of 5th Electronics Packaging Technology Conference, EPTC 2003). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EPTC.2003.1271612

Teo, M. ; Mhaisalkar, S. G. ; Wong, E. H. et al. / Effects of anisotropic conductive adhesive (ACA) material properties on package reliability performance [flip-chip interconnects]. Proceedings of 5th Electronics Packaging Technology Conference, EPTC 2003. editor / Mahadevan K. Iyer ; Yew Cheong Mui ; Kok Chuan Toh. Institute of Electrical and Electronics Engineers Inc., 2003. pp. 718-725 (Proceedings of 5th Electronics Packaging Technology Conference, EPTC 2003).

@inproceedings{b8838d0d149040659d2a12e9ecd46a75,

title = "Effects of anisotropic conductive adhesive (ACA) material properties on package reliability performance [flip-chip interconnects]",

abstract = "Solder alternative technologies for flip-chip interconnections are fast emerging due to the drive for environmental friendly processes. The anisotropic conductive adhesive (ACA) is one promising solder alternative candidate that shows potential for further pitch reduction. The main concern with ACA interconnection is their long-term reliability performance especially in humid environments. Although much work has been published on ACA joint behaviour, studies on correlation of material properties with reliability performance is still lacking. The main objective in this study was to identify the impact of material properties on reliability, so as to engineer highly reliable microelectronics assemblies. Four representative ACA materials (both film and paste types) with diverse properties were selected and reliability tests were carried out. Correlation analysis identified key material properties that contribute to good reliability performance. Findings indicate that the best properties for high reliability assemblies are: high adhesion strength after subjecting to reliability test conditions, low coefficient of moisture expansion and low storage modulus.",

author = "M. Teo and Mhaisalkar, {S. G.} and Wong, {E. H.} and Teo, {Poi Siong} and Wong, {C. C.} and K. Ong and Goh, {Chin Foo}",

note = "Publisher Copyright: {\textcopyright} 2003 IEEE.; 5th Electronics Packaging Technology Conference, EPTC 2003 ; Conference date: 10-12-2003 Through 12-12-2003",

year = "2003",

doi = "10.1109/EPTC.2003.1271612",

language = "English",

series = "Proceedings of 5th Electronics Packaging Technology Conference, EPTC 2003",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

pages = "718--725",

editor = "Iyer, {Mahadevan K.} and Mui, {Yew Cheong} and Toh, {Kok Chuan}",

booktitle = "Proceedings of 5th Electronics Packaging Technology Conference, EPTC 2003",

address = "United States",

}

Teo, M, Mhaisalkar, SG, Wong, EH, Teo, PS, Wong, CC, Ong, K & Goh, CF 2003, Effects of anisotropic conductive adhesive (ACA) material properties on package reliability performance [flip-chip interconnects]. in MK Iyer, YC Mui & KC Toh (eds), Proceedings of 5th Electronics Packaging Technology Conference, EPTC 2003., 1271612, Proceedings of 5th Electronics Packaging Technology Conference, EPTC 2003, Institute of Electrical and Electronics Engineers Inc., pp. 718-725, 5th Electronics Packaging Technology Conference, EPTC 2003, Singapore, Singapore, 12/10/03. https://doi.org/10.1109/EPTC.2003.1271612

Effects of anisotropic conductive adhesive (ACA) material properties on package reliability performance [flip-chip interconnects]. / Teo, M.; Mhaisalkar, S. G.; Wong, E. H. et al.
Proceedings of 5th Electronics Packaging Technology Conference, EPTC 2003. ed. / Mahadevan K. Iyer; Yew Cheong Mui; Kok Chuan Toh. Institute of Electrical and Electronics Engineers Inc., 2003. p. 718-725 1271612 (Proceedings of 5th Electronics Packaging Technology Conference, EPTC 2003).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

TY - GEN

T1 - Effects of anisotropic conductive adhesive (ACA) material properties on package reliability performance [flip-chip interconnects]

AU - Teo, M.

AU - Mhaisalkar, S. G.

AU - Wong, E. H.

AU - Teo, Poi Siong

AU - Wong, C. C.

AU - Ong, K.

AU - Goh, Chin Foo

PY - 2003

Y1 - 2003

N2 - Solder alternative technologies for flip-chip interconnections are fast emerging due to the drive for environmental friendly processes. The anisotropic conductive adhesive (ACA) is one promising solder alternative candidate that shows potential for further pitch reduction. The main concern with ACA interconnection is their long-term reliability performance especially in humid environments. Although much work has been published on ACA joint behaviour, studies on correlation of material properties with reliability performance is still lacking. The main objective in this study was to identify the impact of material properties on reliability, so as to engineer highly reliable microelectronics assemblies. Four representative ACA materials (both film and paste types) with diverse properties were selected and reliability tests were carried out. Correlation analysis identified key material properties that contribute to good reliability performance. Findings indicate that the best properties for high reliability assemblies are: high adhesion strength after subjecting to reliability test conditions, low coefficient of moisture expansion and low storage modulus.

AB - Solder alternative technologies for flip-chip interconnections are fast emerging due to the drive for environmental friendly processes. The anisotropic conductive adhesive (ACA) is one promising solder alternative candidate that shows potential for further pitch reduction. The main concern with ACA interconnection is their long-term reliability performance especially in humid environments. Although much work has been published on ACA joint behaviour, studies on correlation of material properties with reliability performance is still lacking. The main objective in this study was to identify the impact of material properties on reliability, so as to engineer highly reliable microelectronics assemblies. Four representative ACA materials (both film and paste types) with diverse properties were selected and reliability tests were carried out. Correlation analysis identified key material properties that contribute to good reliability performance. Findings indicate that the best properties for high reliability assemblies are: high adhesion strength after subjecting to reliability test conditions, low coefficient of moisture expansion and low storage modulus.

UR - http://www.scopus.com/inward/record.url?scp=84954056192&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84954056192&partnerID=8YFLogxK

U2 - 10.1109/EPTC.2003.1271612

DO - 10.1109/EPTC.2003.1271612

M3 - Conference contribution

AN - SCOPUS:84954056192

T3 - Proceedings of 5th Electronics Packaging Technology Conference, EPTC 2003

SP - 718

EP - 725

BT - Proceedings of 5th Electronics Packaging Technology Conference, EPTC 2003

A2 - Iyer, Mahadevan K.

A2 - Mui, Yew Cheong

A2 - Toh, Kok Chuan

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 5th Electronics Packaging Technology Conference, EPTC 2003

Y2 - 10 December 2003 through 12 December 2003

ER -

Teo M, Mhaisalkar SG, Wong EH, Teo PS, Wong CC, Ong K et al. Effects of anisotropic conductive adhesive (ACA) material properties on package reliability performance [flip-chip interconnects]. In Iyer MK, Mui YC, Toh KC, editors, Proceedings of 5th Electronics Packaging Technology Conference, EPTC 2003. Institute of Electrical and Electronics Engineers Inc. 2003. p. 718-725. 1271612. (Proceedings of 5th Electronics Packaging Technology Conference, EPTC 2003). doi: 10.1109/EPTC.2003.1271612

Effects of anisotropic conductive adhesive (ACA) material properties on package reliability performance [flip-chip interconnects]

Abstract

Publication series

Conference

Bibliographical note

ASJC Scopus Subject Areas

Access to Document

Other files and links

Fingerprint

Cite this