Effects of anisotropic conductive adhesive (ACA) material properties on package reliability performance [flip-chip interconnects]

M. Teo, S. G. Mhaisalkar, E. H. Wong, Poi Siong Teo, C. C. Wong, K. Ong, Chin Foo Goh

Research output: Chapter in Book/Report/Conference proceedingConference contribution

15 Citations (Scopus)

Abstract

Solder alternative technologies for flip-chip interconnections are fast emerging due to the drive for environmental friendly processes. The anisotropic conductive adhesive (ACA) is one promising solder alternative candidate that shows potential for further pitch reduction. The main concern with ACA interconnection is their long-term reliability performance especially in humid environments. Although much work has been published on ACA joint behaviour, studies on correlation of material properties with reliability performance is still lacking. The main objective in this study was to identify the impact of material properties on reliability, so as to engineer highly reliable microelectronics assemblies. Four representative ACA materials (both film and paste types) with diverse properties were selected and reliability tests were carried out. Correlation analysis identified key material properties that contribute to good reliability performance. Findings indicate that the best properties for high reliability assemblies are: high adhesion strength after subjecting to reliability test conditions, low coefficient of moisture expansion and low storage modulus.

Original languageEnglish
Title of host publicationProceedings of 5th Electronics Packaging Technology Conference, EPTC 2003
EditorsMahadevan K. Iyer, Yew Cheong Mui, Kok Chuan Toh
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages718-725
Number of pages8
ISBN (Electronic)0780382056, 9780780382053
DOIs
Publication statusPublished - 2003
Externally publishedYes
Event5th Electronics Packaging Technology Conference, EPTC 2003 - Singapore, Singapore
Duration: Dec 10 2003Dec 12 2003

Publication series

NameProceedings of 5th Electronics Packaging Technology Conference, EPTC 2003

Conference

Conference5th Electronics Packaging Technology Conference, EPTC 2003
Country/TerritorySingapore
CitySingapore
Period12/10/0312/12/03

Bibliographical note

Publisher Copyright:
© 2003 IEEE.

ASJC Scopus Subject Areas

  • Electrical and Electronic Engineering
  • Industrial and Manufacturing Engineering
  • Electronic, Optical and Magnetic Materials

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