Abstract
Solder alternative technologies for flip-chip interconnections are fast emerging due to the drive for environmental friendly processes. The anisotropic conductive adhesive (ACA) is one promising solder alternative candidate that shows potential for further pitch reduction. The main concern with ACA interconnection is their long-term reliability performance especially in humid environments. Although much work has been published on ACA joint behaviour, studies on correlation of material properties with reliability performance is still lacking. The main objective in this study was to identify the impact of material properties on reliability, so as to engineer highly reliable microelectronics assemblies. Four representative ACA materials (both film and paste types) with diverse properties were selected and reliability tests were carried out. Correlation analysis identified key material properties that contribute to good reliability performance. Findings indicate that the best properties for high reliability assemblies are: high adhesion strength after subjecting to reliability test conditions, low coefficient of moisture expansion and low storage modulus.
Original language | English |
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Title of host publication | Proceedings of 5th Electronics Packaging Technology Conference, EPTC 2003 |
Editors | Mahadevan K. Iyer, Yew Cheong Mui, Kok Chuan Toh |
Publisher | Institute of Electrical and Electronics Engineers Inc. |
Pages | 718-725 |
Number of pages | 8 |
ISBN (Electronic) | 0780382056, 9780780382053 |
DOIs | |
Publication status | Published - 2003 |
Externally published | Yes |
Event | 5th Electronics Packaging Technology Conference, EPTC 2003 - Singapore, Singapore Duration: Dec 10 2003 → Dec 12 2003 |
Publication series
Name | Proceedings of 5th Electronics Packaging Technology Conference, EPTC 2003 |
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Conference
Conference | 5th Electronics Packaging Technology Conference, EPTC 2003 |
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Country/Territory | Singapore |
City | Singapore |
Period | 12/10/03 → 12/12/03 |
Bibliographical note
Publisher Copyright:© 2003 IEEE.
ASJC Scopus Subject Areas
- Electrical and Electronic Engineering
- Industrial and Manufacturing Engineering
- Electronic, Optical and Magnetic Materials