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Effects of anisotropic conductive adhesive (ACA) material properties on package reliability performance [flip-chip interconnects]
M. Teo, S. G. Mhaisalkar, E. H. Wong, Poi Siong Teo, C. C. Wong, K. Ong, Chin Foo Goh
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
15
Citations
(Scopus)