TY - GEN
T1 - Effects of silicon substrate on the growth of carbon nanotubes
AU - Yung, K. P.
AU - Wei, J.
AU - Tay, R. Y.J.
AU - Tay, B. K.
PY - 2010
Y1 - 2010
N2 - Due to their extraordinary electrical, thermal and mechanical properties, carbon nanotubes (CNTs) have been foreseen as potential materials for electronics devices in the future. To integrate CNTs in electronic applications, CNTs would need to be deposited on different types of Si substrate. In this study, CNTs were grown on Ni catalyst layer with four types of substrates, namely Si, n++ Si, p++ Si and SiO2, using Plasma Enhanced Chemical Vapor Deposition (PECVD). The morphology and microstructure of the CNT films were analyzed by scanning electron microscopy (SEM) and Raman spectroscope. It was found that the type of Si substrate has significant effects on CNT growing characteristics. The possible mechanisms for the observed results are proposed. These findings add significant reference value to select deposition conditions suitable for deposition of CNTs on different types of Si substrate.
AB - Due to their extraordinary electrical, thermal and mechanical properties, carbon nanotubes (CNTs) have been foreseen as potential materials for electronics devices in the future. To integrate CNTs in electronic applications, CNTs would need to be deposited on different types of Si substrate. In this study, CNTs were grown on Ni catalyst layer with four types of substrates, namely Si, n++ Si, p++ Si and SiO2, using Plasma Enhanced Chemical Vapor Deposition (PECVD). The morphology and microstructure of the CNT films were analyzed by scanning electron microscopy (SEM) and Raman spectroscope. It was found that the type of Si substrate has significant effects on CNT growing characteristics. The possible mechanisms for the observed results are proposed. These findings add significant reference value to select deposition conditions suitable for deposition of CNTs on different types of Si substrate.
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U2 - 10.1115/IMECE2009-10553
DO - 10.1115/IMECE2009-10553
M3 - Conference contribution
AN - SCOPUS:77954296056
SN - 9780791843789
T3 - ASME International Mechanical Engineering Congress and Exposition, Proceedings
SP - 143
EP - 148
BT - Proceedings of the ASME International Mechanical Engineering Congress and Exposition 2009, IMECE 2009
PB - American Society of Mechanical Engineers (ASME)
T2 - 2009 ASME International Mechanical Engineering Congress and Exposition, IMECE2009
Y2 - 13 November 2009 through 19 November 2009
ER -