TY - GEN
T1 - Electric current induced brittle failure of eutectic lead and lead-free solder joints with electroless Ni-P metallization
AU - Kumar, Aditya
AU - Chen, Zhong
AU - Wong, C. C.
AU - Mhaisalkar, S. G.
AU - Kripesh, Vaidhyanathan
PY - 2007
Y1 - 2007
N2 - The mechanical properties of thermally-aged and electric current-stressed eutectic lead (Sn-37Pb) and lead-free (Sn-3.5Ag) solder joints with electroless Ni-P metallization were investigated using tensile testing. Multi-layered test samples, electroless Ni-P/solder/electroless Ni-P, having two electroless Ni-P/solder interfaces were prepared. Tensile testing results showed that for both types of solder, high density electric current causes the brittle failure of solder joint. The eutectic lead solder joint was found to be more prone to current induced brittle failure compared to the lead-free solder joint. In the eutectic lead solder joint, brittle failure always occurred at the cathode side electroless Ni-P/Sn-37Pb interface (where electrons flowed from Ni-P to solder), whereas no such polarity effect was observed in the case of lead-free solder joint.
AB - The mechanical properties of thermally-aged and electric current-stressed eutectic lead (Sn-37Pb) and lead-free (Sn-3.5Ag) solder joints with electroless Ni-P metallization were investigated using tensile testing. Multi-layered test samples, electroless Ni-P/solder/electroless Ni-P, having two electroless Ni-P/solder interfaces were prepared. Tensile testing results showed that for both types of solder, high density electric current causes the brittle failure of solder joint. The eutectic lead solder joint was found to be more prone to current induced brittle failure compared to the lead-free solder joint. In the eutectic lead solder joint, brittle failure always occurred at the cathode side electroless Ni-P/Sn-37Pb interface (where electrons flowed from Ni-P to solder), whereas no such polarity effect was observed in the case of lead-free solder joint.
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M3 - Conference contribution
AN - SCOPUS:34250814216
SN - 1558999256
SN - 9781558999251
T3 - Materials Research Society Symposium Proceedings
SP - 141
EP - 146
BT - Advanced Electronic Packaging
T2 - 2006 MRS Fall Meeting
Y2 - 27 November 2006 through 30 November 2006
ER -