Electroless Nickel-Plated UV-Embossed Microstructured Surface with Very High Aspect Ratio Channels

Yehai Yan, Mary B. Chan-Park*, Jianxia Gao, C. Y. Yue

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

23 Citations (Scopus)

Abstract

The very high aspect ratio (14) and deep (132μm) channels of an UV-embossed polymeric microstructured surface were successfully metallized by electroless nickel plating. A submicron conformal and highly adherent nickel coating was uniformly deposited on all the hydrophobic silicone-enriched surfaces of the channels. The nickel surface layer acts as a diffusion barrier and also allows for easy subsequent chemical modification by chemical grafting, electroplating, or electropolymerization for diverse applications in micromolding, microfluidics, sensors, microreactors, biomedical devices, and so forth. Hence, electroless nickel plating combined with UV embossing allows easy fabrication of high aspect ratio metallized polymeric microstructures with tailored surfaces.

Original languageEnglish
Pages (from-to)1031-1035
Number of pages5
JournalLangmuir
Volume20
Issue number4
DOIs
Publication statusPublished - Feb 17 2004
Externally publishedYes

ASJC Scopus Subject Areas

  • General Materials Science
  • Condensed Matter Physics
  • Surfaces and Interfaces
  • Spectroscopy
  • Electrochemistry

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