Electromigration-induced extrusion failures in Cu/low-k interconnects

Material Science

• Anode 50%
• Crack Propagation 50%
• Delamination 50%
• Dielectric Material 50%
• Elastic Moduli 50%
• Finite Element Method 50%
• Fracture Toughness 50%
• Lining 100%
• Scanning Electron Microscopy 50%
• Silicon Nitride 50%
• Transmission Electron Microscopy 50%
• Void Growth 50%

Keyphrases

• Extrusion Damage 20%
• Extrusion Failure 100%
• Interlevel Dielectrics 20%
• Mode I Loading 20%
• Plane Strain Crack 20%
• Thin Liner 20%
• Underlayer Material 20%

Engineering

• Crack Geometry 20%