Electronic packages for high pressure applications: A dome-shaped cavity design

Eric Phua Jian Rong; I. Made Riko; Ahmed Sharif; Wong Chee Cheong; Chen Zhong; Daniel Rhee Minwoo; Gan Chee Lip

doi:10.1109/ECTC.2013.6575911

Electronic packages for high pressure applications: A dome-shaped cavity design

Eric Phua Jian Rong, I. Made Riko, Ahmed Sharif, Wong Chee Cheong, Chen Zhong, Daniel Rhee Minwoo, Gan Chee Lip

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

2 Citations (Scopus)

Abstract

Epoxy type encapsulation does not suffice in High Pressure High Temperature (HPHT) environment and hence is not suitable for harsh environment applications. In this work, alternative encapsulation methods exploring the use of thickened lid/base and a novel dome shaped cavity design would be discussed. Results show that such methods are viable and are possible alternatives for similar harsh environment applications.

Original language	English
Title of host publication	2013 IEEE 63rd Electronic Components and Technology Conference, ECTC 2013
Pages	2342-2348
Number of pages	7
DOIs	https://doi.org/10.1109/ECTC.2013.6575911
Publication status	Published - 2013
Externally published	Yes
Event	2013 IEEE 63rd Electronic Components and Technology Conference, ECTC 2013 - Las Vegas, NV, United States Duration: May 28 2013 → May 31 2013

Publication series

Name	Proceedings - Electronic Components and Technology Conference
ISSN (Print)	0569-5503

Conference

Conference	2013 IEEE 63rd Electronic Components and Technology Conference, ECTC 2013
Country/Territory	United States
City	Las Vegas, NV
Period	5/28/13 → 5/31/13

ASJC Scopus Subject Areas

Electronic, Optical and Magnetic Materials
Electrical and Electronic Engineering

Access to Document

10.1109/ECTC.2013.6575911

Cite this

Rong, E. P. J., Riko, I. M., Sharif, A., Cheong, W. C., Zhong, C., Minwoo, D. R., & Lip, G. C. (2013). Electronic packages for high pressure applications: A dome-shaped cavity design. In 2013 IEEE 63rd Electronic Components and Technology Conference, ECTC 2013 (pp. 2342-2348). Article 6575911 (Proceedings - Electronic Components and Technology Conference). https://doi.org/10.1109/ECTC.2013.6575911

@inproceedings{239ac37b76414a879e97a5e5aa4d105e,

title = "Electronic packages for high pressure applications: A dome-shaped cavity design",

abstract = "Epoxy type encapsulation does not suffice in High Pressure High Temperature (HPHT) environment and hence is not suitable for harsh environment applications. In this work, alternative encapsulation methods exploring the use of thickened lid/base and a novel dome shaped cavity design would be discussed. Results show that such methods are viable and are possible alternatives for similar harsh environment applications.",

author = "Rong, {Eric Phua Jian} and Riko, {I. Made} and Ahmed Sharif and Cheong, {Wong Chee} and Chen Zhong and Minwoo, {Daniel Rhee} and Lip, {Gan Chee}",

year = "2013",

doi = "10.1109/ECTC.2013.6575911",

language = "English",

isbn = "9781479902330",

series = "Proceedings - Electronic Components and Technology Conference",

pages = "2342--2348",

booktitle = "2013 IEEE 63rd Electronic Components and Technology Conference, ECTC 2013",

note = "2013 IEEE 63rd Electronic Components and Technology Conference, ECTC 2013 ; Conference date: 28-05-2013 Through 31-05-2013",

}

Rong, EPJ, Riko, IM, Sharif, A, Cheong, WC, Zhong, C, Minwoo, DR & Lip, GC 2013, Electronic packages for high pressure applications: A dome-shaped cavity design. in 2013 IEEE 63rd Electronic Components and Technology Conference, ECTC 2013., 6575911, Proceedings - Electronic Components and Technology Conference, pp. 2342-2348, 2013 IEEE 63rd Electronic Components and Technology Conference, ECTC 2013, Las Vegas, NV, United States, 5/28/13. https://doi.org/10.1109/ECTC.2013.6575911

Electronic packages for high pressure applications: A dome-shaped cavity design. / Rong, Eric Phua Jian; Riko, I. Made; Sharif, Ahmed et al.
2013 IEEE 63rd Electronic Components and Technology Conference, ECTC 2013. 2013. p. 2342-2348 6575911 (Proceedings - Electronic Components and Technology Conference).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

TY - GEN

T1 - Electronic packages for high pressure applications

T2 - 2013 IEEE 63rd Electronic Components and Technology Conference, ECTC 2013

AU - Rong, Eric Phua Jian

AU - Riko, I. Made

AU - Sharif, Ahmed

AU - Cheong, Wong Chee

AU - Zhong, Chen

AU - Minwoo, Daniel Rhee

AU - Lip, Gan Chee

PY - 2013

Y1 - 2013

N2 - Epoxy type encapsulation does not suffice in High Pressure High Temperature (HPHT) environment and hence is not suitable for harsh environment applications. In this work, alternative encapsulation methods exploring the use of thickened lid/base and a novel dome shaped cavity design would be discussed. Results show that such methods are viable and are possible alternatives for similar harsh environment applications.

AB - Epoxy type encapsulation does not suffice in High Pressure High Temperature (HPHT) environment and hence is not suitable for harsh environment applications. In this work, alternative encapsulation methods exploring the use of thickened lid/base and a novel dome shaped cavity design would be discussed. Results show that such methods are viable and are possible alternatives for similar harsh environment applications.

UR - http://www.scopus.com/inward/record.url?scp=84883327364&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84883327364&partnerID=8YFLogxK

U2 - 10.1109/ECTC.2013.6575911

DO - 10.1109/ECTC.2013.6575911

M3 - Conference contribution

AN - SCOPUS:84883327364

SN - 9781479902330

T3 - Proceedings - Electronic Components and Technology Conference

SP - 2342

EP - 2348

BT - 2013 IEEE 63rd Electronic Components and Technology Conference, ECTC 2013

Y2 - 28 May 2013 through 31 May 2013

ER -

Electronic packages for high pressure applications: A dome-shaped cavity design

Abstract

Publication series

Conference

ASJC Scopus Subject Areas

Access to Document

Other files and links

Fingerprint

Cite this