Enhanced heat transfer performance with designed pin fin cold plate for 50 kW high power density converter

Lingxi Zhang; Ziyou Lim; Arie Nawawi; Yong Liu; Josep Pou; Rejeki Simanjorang

doi:10.1109/APEC.2019.8722001

Enhanced heat transfer performance with designed pin fin cold plate for 50 kW high power density converter

Lingxi Zhang, Ziyou Lim, Arie Nawawi, Yong Liu, Josep Pou, Rejeki Simanjorang

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

Cooling requirement is very stringent for power converters in aircraft due to high power density and high switching frequency. The total thermal loss rises as the power and switching frequency increase. This paper demonstrates a pin fin cold plate designed for a 60 kHz 50 kW/400 Hz three-phase two-level high power density converter (HPDC). Simulation results and experimental results indicate that the pin fin cold plate has lower thermal resistance (Rth) and requires lower pump power compared with the two-pipe cold plate. The Silicon Carbide (SiC) power module junction temperature is within the limitation when maximum power loss (3%) occurs on each module. Thermal interface material (TIM) is the weakest part with the lowest thermal conductivity in the heat transfer path. Therefore, Panasonic Graphite Sheet (PGS) is studied and applied with minimum 8.8% temperature decrease compared with thermal grease.

Original language	English
Title of host publication	34th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2019
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	1365-1369
Number of pages	5
ISBN (Electronic)	9781538683309
DOIs	https://doi.org/10.1109/APEC.2019.8722001
Publication status	Published - May 24 2019
Externally published	Yes
Event	34th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2019 - Anaheim, United States Duration: Mar 17 2019 → Mar 21 2019

Publication series

Name	Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC
Volume	2019-March

Conference

Conference	34th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2019
Country/Territory	United States
City	Anaheim
Period	3/17/19 → 3/21/19

Bibliographical note

Publisher Copyright:
© 2019 IEEE.

ASJC Scopus Subject Areas

Electrical and Electronic Engineering

Keywords

High power density converter
Panasonic Graphite Sheet (PGS)
Pin fin cold plate
Thermal interface material (TIM)

Access to Document

10.1109/APEC.2019.8722001

Cite this

Zhang, L., Lim, Z., Nawawi, A., Liu, Y., Pou, J., & Simanjorang, R. (2019). Enhanced heat transfer performance with designed pin fin cold plate for 50 kW high power density converter. In 34th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2019 (pp. 1365-1369). Article 8722001 (Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC; Vol. 2019-March). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/APEC.2019.8722001

Zhang, Lingxi ; Lim, Ziyou ; Nawawi, Arie et al. / Enhanced heat transfer performance with designed pin fin cold plate for 50 kW high power density converter. 34th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2019. Institute of Electrical and Electronics Engineers Inc., 2019. pp. 1365-1369 (Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC).

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title = "Enhanced heat transfer performance with designed pin fin cold plate for 50 kW high power density converter",

abstract = "Cooling requirement is very stringent for power converters in aircraft due to high power density and high switching frequency. The total thermal loss rises as the power and switching frequency increase. This paper demonstrates a pin fin cold plate designed for a 60 kHz 50 kW/400 Hz three-phase two-level high power density converter (HPDC). Simulation results and experimental results indicate that the pin fin cold plate has lower thermal resistance (Rth) and requires lower pump power compared with the two-pipe cold plate. The Silicon Carbide (SiC) power module junction temperature is within the limitation when maximum power loss (3%) occurs on each module. Thermal interface material (TIM) is the weakest part with the lowest thermal conductivity in the heat transfer path. Therefore, Panasonic Graphite Sheet (PGS) is studied and applied with minimum 8.8% temperature decrease compared with thermal grease.",

keywords = "High power density converter, Panasonic Graphite Sheet (PGS), Pin fin cold plate, Thermal interface material (TIM)",

author = "Lingxi Zhang and Ziyou Lim and Arie Nawawi and Yong Liu and Josep Pou and Rejeki Simanjorang",

note = "Publisher Copyright: {\textcopyright} 2019 IEEE.; 34th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2019 ; Conference date: 17-03-2019 Through 21-03-2019",

year = "2019",

month = may,

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doi = "10.1109/APEC.2019.8722001",

language = "English",

series = "Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC",

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Zhang, L, Lim, Z, Nawawi, A, Liu, Y, Pou, J & Simanjorang, R 2019, Enhanced heat transfer performance with designed pin fin cold plate for 50 kW high power density converter. in 34th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2019., 8722001, Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC, vol. 2019-March, Institute of Electrical and Electronics Engineers Inc., pp. 1365-1369, 34th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2019, Anaheim, United States, 3/17/19. https://doi.org/10.1109/APEC.2019.8722001

Enhanced heat transfer performance with designed pin fin cold plate for 50 kW high power density converter. / Zhang, Lingxi; Lim, Ziyou; Nawawi, Arie et al.
34th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2019. Institute of Electrical and Electronics Engineers Inc., 2019. p. 1365-1369 8722001 (Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC; Vol. 2019-March).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

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T1 - Enhanced heat transfer performance with designed pin fin cold plate for 50 kW high power density converter

AU - Zhang, Lingxi

AU - Lim, Ziyou

AU - Nawawi, Arie

AU - Liu, Yong

AU - Pou, Josep

AU - Simanjorang, Rejeki

PY - 2019/5/24

Y1 - 2019/5/24

N2 - Cooling requirement is very stringent for power converters in aircraft due to high power density and high switching frequency. The total thermal loss rises as the power and switching frequency increase. This paper demonstrates a pin fin cold plate designed for a 60 kHz 50 kW/400 Hz three-phase two-level high power density converter (HPDC). Simulation results and experimental results indicate that the pin fin cold plate has lower thermal resistance (Rth) and requires lower pump power compared with the two-pipe cold plate. The Silicon Carbide (SiC) power module junction temperature is within the limitation when maximum power loss (3%) occurs on each module. Thermal interface material (TIM) is the weakest part with the lowest thermal conductivity in the heat transfer path. Therefore, Panasonic Graphite Sheet (PGS) is studied and applied with minimum 8.8% temperature decrease compared with thermal grease.

AB - Cooling requirement is very stringent for power converters in aircraft due to high power density and high switching frequency. The total thermal loss rises as the power and switching frequency increase. This paper demonstrates a pin fin cold plate designed for a 60 kHz 50 kW/400 Hz three-phase two-level high power density converter (HPDC). Simulation results and experimental results indicate that the pin fin cold plate has lower thermal resistance (Rth) and requires lower pump power compared with the two-pipe cold plate. The Silicon Carbide (SiC) power module junction temperature is within the limitation when maximum power loss (3%) occurs on each module. Thermal interface material (TIM) is the weakest part with the lowest thermal conductivity in the heat transfer path. Therefore, Panasonic Graphite Sheet (PGS) is studied and applied with minimum 8.8% temperature decrease compared with thermal grease.

KW - High power density converter

KW - Panasonic Graphite Sheet (PGS)

KW - Pin fin cold plate

KW - Thermal interface material (TIM)

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BT - 34th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2019

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ER -

Zhang L, Lim Z, Nawawi A, Liu Y, Pou J, Simanjorang R. Enhanced heat transfer performance with designed pin fin cold plate for 50 kW high power density converter. In 34th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2019. Institute of Electrical and Electronics Engineers Inc. 2019. p. 1365-1369. 8722001. (Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC). doi: 10.1109/APEC.2019.8722001

Enhanced heat transfer performance with designed pin fin cold plate for 50 kW high power density converter

Abstract

Publication series

Conference

Bibliographical note

ASJC Scopus Subject Areas

Keywords

Access to Document

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Cite this