Evaluation of copper nanoparticles for low temperature bonded interconnections

Byung Hoon Lee; Mei Zhen Ng; Alfred A. Zinn; Chee Lip Gan

doi:10.1109/IPFA.2015.7224343

Evaluation of copper nanoparticles for low temperature bonded interconnections

Byung Hoon Lee, Mei Zhen Ng, Alfred A. Zinn, Chee Lip Gan

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

13 Citations (Scopus)

Abstract

In this study, we evaluate the application of copper nanoparticles as a low temperature bonded interconnection. The copper nanoparticles have an organic passivation layer which stabilizes them, preventing spontaneous particle fusion and growth at ambient temperatures, as well as avoiding oxidation before its usage. Thermogravimetric analysis and differential scanning calorimetry show that the solvents and passivation layer can be removed completely from the copper nanoparticles paste by a sintering profile of up to 200°C. Cross sectional analysis show that the copper nanoparticles have fused to create a low porosity layer that gave good shear strength of the bonded joint. Moreover, Cu nanoparticles bonded samples demonstrate excellent thermal stability after 1000 h of aging at 150°C under normal ambient, as the shear strength of the joints increased instead without any observable oxidation of the Cu nanoparticles layer. Lastly, the addition of copper nanowires to the nanoparticles paste further improves the mechanical strength of the bonded interconnections due to the retardation of the crack propagation.

Original language	English
Title of host publication	Proceedings of the 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2015
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	102-106
Number of pages	5
ISBN (Electronic)	9781479999286, 9781479999286
DOIs	https://doi.org/10.1109/IPFA.2015.7224343
Publication status	Published - Aug 25 2015
Externally published	Yes
Event	22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2015 - Hsinchu, Taiwan, Province of China Duration: Jun 29 2015 → Jul 2 2015

Publication series

Name	Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA
Volume	2015-August

Conference

Conference	22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2015
Country/Territory	Taiwan, Province of China
City	Hsinchu
Period	6/29/15 → 7/2/15

Bibliographical note

Publisher Copyright:
© 2015 IEEE.

ASJC Scopus Subject Areas

Electrical and Electronic Engineering

Access to Document

10.1109/IPFA.2015.7224343

Cite this

Lee, B. H., Ng, M. Z., Zinn, A. A., & Gan, C. L. (2015). Evaluation of copper nanoparticles for low temperature bonded interconnections. In Proceedings of the 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2015 (pp. 102-106). Article 7224343 (Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA; Vol. 2015-August). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/IPFA.2015.7224343

Lee, Byung Hoon ; Ng, Mei Zhen ; Zinn, Alfred A. et al. / Evaluation of copper nanoparticles for low temperature bonded interconnections. Proceedings of the 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2015. Institute of Electrical and Electronics Engineers Inc., 2015. pp. 102-106 (Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA).

@inproceedings{2c0e2e2f7e3749fdb312e5185bafe352,

title = "Evaluation of copper nanoparticles for low temperature bonded interconnections",

abstract = "In this study, we evaluate the application of copper nanoparticles as a low temperature bonded interconnection. The copper nanoparticles have an organic passivation layer which stabilizes them, preventing spontaneous particle fusion and growth at ambient temperatures, as well as avoiding oxidation before its usage. Thermogravimetric analysis and differential scanning calorimetry show that the solvents and passivation layer can be removed completely from the copper nanoparticles paste by a sintering profile of up to 200°C. Cross sectional analysis show that the copper nanoparticles have fused to create a low porosity layer that gave good shear strength of the bonded joint. Moreover, Cu nanoparticles bonded samples demonstrate excellent thermal stability after 1000 h of aging at 150°C under normal ambient, as the shear strength of the joints increased instead without any observable oxidation of the Cu nanoparticles layer. Lastly, the addition of copper nanowires to the nanoparticles paste further improves the mechanical strength of the bonded interconnections due to the retardation of the crack propagation.",

author = "Lee, {Byung Hoon} and Ng, {Mei Zhen} and Zinn, {Alfred A.} and Gan, {Chee Lip}",

note = "Publisher Copyright: {\textcopyright} 2015 IEEE.; 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2015 ; Conference date: 29-06-2015 Through 02-07-2015",

year = "2015",

month = aug,

day = "25",

doi = "10.1109/IPFA.2015.7224343",

language = "English",

series = "Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

pages = "102--106",

booktitle = "Proceedings of the 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2015",

address = "United States",

}

Lee, BH, Ng, MZ, Zinn, AA & Gan, CL 2015, Evaluation of copper nanoparticles for low temperature bonded interconnections. in Proceedings of the 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2015., 7224343, Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA, vol. 2015-August, Institute of Electrical and Electronics Engineers Inc., pp. 102-106, 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2015, Hsinchu, Taiwan, Province of China, 6/29/15. https://doi.org/10.1109/IPFA.2015.7224343

Evaluation of copper nanoparticles for low temperature bonded interconnections. / Lee, Byung Hoon; Ng, Mei Zhen; Zinn, Alfred A. et al.
Proceedings of the 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2015. Institute of Electrical and Electronics Engineers Inc., 2015. p. 102-106 7224343 (Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA; Vol. 2015-August).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

TY - GEN

T1 - Evaluation of copper nanoparticles for low temperature bonded interconnections

AU - Lee, Byung Hoon

AU - Ng, Mei Zhen

AU - Zinn, Alfred A.

AU - Gan, Chee Lip

PY - 2015/8/25

Y1 - 2015/8/25

N2 - In this study, we evaluate the application of copper nanoparticles as a low temperature bonded interconnection. The copper nanoparticles have an organic passivation layer which stabilizes them, preventing spontaneous particle fusion and growth at ambient temperatures, as well as avoiding oxidation before its usage. Thermogravimetric analysis and differential scanning calorimetry show that the solvents and passivation layer can be removed completely from the copper nanoparticles paste by a sintering profile of up to 200°C. Cross sectional analysis show that the copper nanoparticles have fused to create a low porosity layer that gave good shear strength of the bonded joint. Moreover, Cu nanoparticles bonded samples demonstrate excellent thermal stability after 1000 h of aging at 150°C under normal ambient, as the shear strength of the joints increased instead without any observable oxidation of the Cu nanoparticles layer. Lastly, the addition of copper nanowires to the nanoparticles paste further improves the mechanical strength of the bonded interconnections due to the retardation of the crack propagation.

AB - In this study, we evaluate the application of copper nanoparticles as a low temperature bonded interconnection. The copper nanoparticles have an organic passivation layer which stabilizes them, preventing spontaneous particle fusion and growth at ambient temperatures, as well as avoiding oxidation before its usage. Thermogravimetric analysis and differential scanning calorimetry show that the solvents and passivation layer can be removed completely from the copper nanoparticles paste by a sintering profile of up to 200°C. Cross sectional analysis show that the copper nanoparticles have fused to create a low porosity layer that gave good shear strength of the bonded joint. Moreover, Cu nanoparticles bonded samples demonstrate excellent thermal stability after 1000 h of aging at 150°C under normal ambient, as the shear strength of the joints increased instead without any observable oxidation of the Cu nanoparticles layer. Lastly, the addition of copper nanowires to the nanoparticles paste further improves the mechanical strength of the bonded interconnections due to the retardation of the crack propagation.

UR - http://www.scopus.com/inward/record.url?scp=84949758267&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84949758267&partnerID=8YFLogxK

U2 - 10.1109/IPFA.2015.7224343

DO - 10.1109/IPFA.2015.7224343

M3 - Conference contribution

AN - SCOPUS:84949758267

T3 - Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA

SP - 102

EP - 106

BT - Proceedings of the 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2015

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2015

Y2 - 29 June 2015 through 2 July 2015

ER -

Lee BH, Ng MZ, Zinn AA, Gan CL. Evaluation of copper nanoparticles for low temperature bonded interconnections. In Proceedings of the 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2015. Institute of Electrical and Electronics Engineers Inc. 2015. p. 102-106. 7224343. (Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA). doi: 10.1109/IPFA.2015.7224343

Evaluation of copper nanoparticles for low temperature bonded interconnections

Abstract

Publication series

Conference

Bibliographical note

ASJC Scopus Subject Areas

Access to Document

Other files and links

Fingerprint

Cite this