Experimental characterization and modeling of the reliability of three-terminal dual-damascene Cu interconnect trees

C. L. Gan; C. V. Thompson; K. L. Pey; W. K. Choi

doi:10.1063/1.1585119

Experimental characterization and modeling of the reliability of three-terminal dual-damascene Cu interconnect trees

C. L. Gan^*, C. V. Thompson, K. L. Pey, W. K. Choi

^*Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

55 Citations (Scopus)

Abstract

The modeling and characterization of the reliability of the dual-damascene copper interconnect trees was discussed. The reliability depends on the stress conditions of the connected segments. However, electromigration tests revealed different results for copper based trees and aluminium based trees. The architectural schemes of the two metallization systems were found as the reason behind this difference.

Original language	English
Pages (from-to)	1222-1228
Number of pages	7
Journal	Journal of Applied Physics
Volume	94
Issue number	2
DOIs	https://doi.org/10.1063/1.1585119
Publication status	Published - Jul 15 2003
Externally published	Yes

ASJC Scopus Subject Areas

General Physics and Astronomy

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10.1063/1.1585119

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title = "Experimental characterization and modeling of the reliability of three-terminal dual-damascene Cu interconnect trees",

abstract = "The modeling and characterization of the reliability of the dual-damascene copper interconnect trees was discussed. The reliability depends on the stress conditions of the connected segments. However, electromigration tests revealed different results for copper based trees and aluminium based trees. The architectural schemes of the two metallization systems were found as the reason behind this difference.",

author = "Gan, {C. L.} and Thompson, {C. V.} and Pey, {K. L.} and Choi, {W. K.}",

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AU - Pey, K. L.

AU - Choi, W. K.

PY - 2003/7/15

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N2 - The modeling and characterization of the reliability of the dual-damascene copper interconnect trees was discussed. The reliability depends on the stress conditions of the connected segments. However, electromigration tests revealed different results for copper based trees and aluminium based trees. The architectural schemes of the two metallization systems were found as the reason behind this difference.

AB - The modeling and characterization of the reliability of the dual-damascene copper interconnect trees was discussed. The reliability depends on the stress conditions of the connected segments. However, electromigration tests revealed different results for copper based trees and aluminium based trees. The architectural schemes of the two metallization systems were found as the reason behind this difference.

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Experimental characterization and modeling of the reliability of three-terminal dual-damascene Cu interconnect trees

Abstract

ASJC Scopus Subject Areas

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