TY - GEN
T1 - Extreme high pressure and high temperature package development
AU - Yuan, Hwang How
AU - Leong Ching, Eva Wai
AU - Sing, Chan Yuen
AU - Chidambaram, Vivek
AU - Bum, Lee Jong
AU - Jian Rong, Eric Phua
AU - Lip, Gan Chee
AU - Min Woo, Daniel Rhee
PY - 2013
Y1 - 2013
N2 - As oil and gas industries ventured further and deeper into the earth or ocean in search for new reservoirs, the requirements of depth, pressure and temperature are ever expanding. Conventionally, ceramic based hermetic sealed packaging is used for high temperature endurable package. However, for the case of highly pressurized application, the stress on the package is substantial and the hermetically sealed ceramic package cannot survive under a high pressure up to 30kpsi. To overcome this limitation, the authors are proposing to fill high temperature and high pressure endurable protective materials inside of ceramic substrate cavity to absorb the package internal stress caused by the external high pressure loading. The reliability of the package has been successfully demonstrated under combined 30kpsi isostatic pressure and 300°C temperature (HPHT) aging condition for 500 hours as well as thermal cycling condition for 500 cycles.
AB - As oil and gas industries ventured further and deeper into the earth or ocean in search for new reservoirs, the requirements of depth, pressure and temperature are ever expanding. Conventionally, ceramic based hermetic sealed packaging is used for high temperature endurable package. However, for the case of highly pressurized application, the stress on the package is substantial and the hermetically sealed ceramic package cannot survive under a high pressure up to 30kpsi. To overcome this limitation, the authors are proposing to fill high temperature and high pressure endurable protective materials inside of ceramic substrate cavity to absorb the package internal stress caused by the external high pressure loading. The reliability of the package has been successfully demonstrated under combined 30kpsi isostatic pressure and 300°C temperature (HPHT) aging condition for 500 hours as well as thermal cycling condition for 500 cycles.
UR - http://www.scopus.com/inward/record.url?scp=84897745221&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84897745221&partnerID=8YFLogxK
U2 - 10.1109/EPTC.2013.6745746
DO - 10.1109/EPTC.2013.6745746
M3 - Conference contribution
AN - SCOPUS:84897745221
SN - 9781479928330
T3 - Proceedings of the 2013 IEEE 15th Electronics Packaging Technology Conference, EPTC 2013
SP - 379
EP - 383
BT - Proceedings of the 2013 IEEE 15th Electronics Packaging Technology Conference, EPTC 2013
T2 - 2013 IEEE 15th Electronics Packaging Technology Conference, EPTC 2013
Y2 - 11 December 2013 through 13 December 2013
ER -