Fabrication of embedded conductive layer in polymer by plasma, immersion ion implantation

Peter C.T. Ha*, Z. J. Han, B. K. Tay

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Plasma immersion ion implantation (PIII) offers an alternative to ion beam with the advantage of high implantation rate. However, problems inherent to the application of PIII to non-conducting materials such as polymers are due to surface charging. To overcome these difficulties and to have a controllable implantation depth, we sputtered a thin layer of gold before PIII is applied to the polymer substrate. The result is a controllable implantation depth and stronger adhesion between the metal-polymer interfaces. The extent of implantation depth can be correlated to tribological properties, electrical conductivity and Raman spectroscopy. While conductive AFM confirmed the conductivity of the embedded layer, the future applications, difficulties and limitations using this technique for fabrication of conductive embedded layer in polymers are also discussed.

Original languageEnglish
Title of host publicationSmart Materials IV
DOIs
Publication statusPublished - 2007
Externally publishedYes
EventSPIE International Symposium on Smart Materials, Nano- and Micro-Smart Systems - Adelaide, Australia
Duration: Dec 11 2006Dec 13 2006

Publication series

NameProceedings of SPIE - The International Society for Optical Engineering
Volume6413
ISSN (Print)0277-786X

Conference

ConferenceSPIE International Symposium on Smart Materials, Nano- and Micro-Smart Systems
Country/TerritoryAustralia
CityAdelaide
Period12/11/0612/13/06

ASJC Scopus Subject Areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

Keywords

  • Cathodic arc and polymer
  • Conductive AFM
  • Plasma immersion ion implantation (PIII)

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