TY - GEN
T1 - Factors affecting the mechanical properties of Cu/electroless Ni-P/Sn-3.5Ag solder joints
AU - Kumar, Aditya
AU - Chen, Zhong
AU - Wong, C. C.
AU - Mhaisalkar, S. G.
AU - Kripesh, Vaidhyanathan
PY - 2007
Y1 - 2007
N2 - This work investigates the factors that affect the mechanical properties of Cu/electroless Ni-P/Sn-3.5Ag solder joints. For the investigation, solder joints were tensile tested after solid-state aging at different temperatures for various durations. Several factors, such as the growth of interfacial compounds (IFCs), Ni3Sn4 morphology, the accumulation of spalled Ni3Sn4 intermetallic particles at the solder/Ni 3Sn4 interface, and the formation of Kirkendall voids at the Ni3P/Cu interface, are found to deteriorate the mechanical properties of the joints. Among all these factors, the formation of a layer of Kirkendall voids at the Ni3P/Cu interface, which is a result of Cu diffusion from the interface, causes the most severe decrease in tensile strength with a brittle fracture at the Ni3P/Cu interface. This layer of Kirkendall voids remains the main cause of brittle failure even after the transformation of the Ni3P layer into a Ni-Sn-P layer.
AB - This work investigates the factors that affect the mechanical properties of Cu/electroless Ni-P/Sn-3.5Ag solder joints. For the investigation, solder joints were tensile tested after solid-state aging at different temperatures for various durations. Several factors, such as the growth of interfacial compounds (IFCs), Ni3Sn4 morphology, the accumulation of spalled Ni3Sn4 intermetallic particles at the solder/Ni 3Sn4 interface, and the formation of Kirkendall voids at the Ni3P/Cu interface, are found to deteriorate the mechanical properties of the joints. Among all these factors, the formation of a layer of Kirkendall voids at the Ni3P/Cu interface, which is a result of Cu diffusion from the interface, causes the most severe decrease in tensile strength with a brittle fracture at the Ni3P/Cu interface. This layer of Kirkendall voids remains the main cause of brittle failure even after the transformation of the Ni3P layer into a Ni-Sn-P layer.
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M3 - Conference contribution
AN - SCOPUS:34250804718
SN - 1558999256
SN - 9781558999251
T3 - Materials Research Society Symposium Proceedings
SP - 117
EP - 123
BT - Advanced Electronic Packaging
T2 - 2006 MRS Fall Meeting
Y2 - 27 November 2006 through 30 November 2006
ER -