Guest Editorial for IRSP 2018 Conference

Arief Suriadi Budiman, Chee Lip Gan, Kin Leong Pey, Valeriy Sukharev, Olivier Thomas

Research output: Contribution to journalEditorialpeer-review

Original languageEnglish
Article number8563158
Pages (from-to)487-489
Number of pages3
JournalIEEE Transactions on Device and Materials Reliability
Volume18
Issue number4
DOIs
Publication statusPublished - Dec 2018
Externally publishedYes

ASJC Scopus Subject Areas

  • Electronic, Optical and Magnetic Materials
  • Safety, Risk, Reliability and Quality
  • Electrical and Electronic Engineering

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