Hardware Security Assessment through Repair of Damaged Device

S. Y. Sim; Q. Liu; H. B. Kor; C. L. Gan

doi:10.1109/IPFA58228.2023.10249101

Hardware Security Assessment through Repair of Damaged Device

S. Y. Sim^*, Q. Liu, H. B. Kor, C. L. Gan

^*Corresponding author for this work

Nanyang Technological University

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

In this paper, the feasibility of content access to physically damaged electronic device was explored by performing package level repair through transplantation of its intact silicon chip from its faulty substrate package onto another functional one, and establishment of new electrical connections between them. This functionality restoration of a damaged device was investigated using an integration of various sample preparation techniques commonly used in microelectronics failure analysis. Different decapsulation techniques were also studied to identify the optimal processes for this application. The repaired device was tested to verify the restoration of its functionality, as well as the integrity of the stored data. This may pave the way for new hardware security assessment approach for electronic devices with other types of packaging.

Original language	English
Title of host publication	2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2023
Publisher	Institute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)	9798350301649
DOIs	https://doi.org/10.1109/IPFA58228.2023.10249101
Publication status	Published - 2023
Externally published	Yes
Event	2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2023 - Pulau Pinang, Malaysia Duration: Jul 24 2023 → Jul 27 2023

Publication series

Name	Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA
Volume	2023-July

Conference

Conference	2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2023
Country/Territory	Malaysia
City	Pulau Pinang
Period	7/24/23 → 7/27/23

Bibliographical note

Publisher Copyright:
© 2023 IEEE.

ASJC Scopus Subject Areas

Electrical and Electronic Engineering

Keywords

damaged device repair
data extraction
functionality restoration
microchip decapsulation

Access to Document

10.1109/IPFA58228.2023.10249101

Cite this

Sim, S. Y., Liu, Q., Kor, H. B., & Gan, C. L. (2023). Hardware Security Assessment through Repair of Damaged Device. In 2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2023 (Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA; Vol. 2023-July). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/IPFA58228.2023.10249101

Sim, S. Y. ; Liu, Q. ; Kor, H. B. et al. / Hardware Security Assessment through Repair of Damaged Device. 2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2023. Institute of Electrical and Electronics Engineers Inc., 2023. (Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA).

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abstract = "In this paper, the feasibility of content access to physically damaged electronic device was explored by performing package level repair through transplantation of its intact silicon chip from its faulty substrate package onto another functional one, and establishment of new electrical connections between them. This functionality restoration of a damaged device was investigated using an integration of various sample preparation techniques commonly used in microelectronics failure analysis. Different decapsulation techniques were also studied to identify the optimal processes for this application. The repaired device was tested to verify the restoration of its functionality, as well as the integrity of the stored data. This may pave the way for new hardware security assessment approach for electronic devices with other types of packaging.",

keywords = "damaged device repair, data extraction, functionality restoration, microchip decapsulation",

author = "Sim, \{S. Y.\} and Q. Liu and Kor, \{H. B.\} and Gan, \{C. L.\}",

note = "Publisher Copyright: {\textcopyright} 2023 IEEE.; 2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2023 ; Conference date: 24-07-2023 Through 27-07-2023",

year = "2023",

doi = "10.1109/IPFA58228.2023.10249101",

language = "English",

series = "Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA",

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Sim, SY, Liu, Q, Kor, HB & Gan, CL 2023, Hardware Security Assessment through Repair of Damaged Device. in 2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2023. Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA, vol. 2023-July, Institute of Electrical and Electronics Engineers Inc., 2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2023, Pulau Pinang, Malaysia, 7/24/23. https://doi.org/10.1109/IPFA58228.2023.10249101

Hardware Security Assessment through Repair of Damaged Device. / Sim, S. Y.; Liu, Q.; Kor, H. B. et al.
2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2023. Institute of Electrical and Electronics Engineers Inc., 2023. (Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA; Vol. 2023-July).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

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Sim SY, Liu Q, Kor HB, Gan CL. Hardware Security Assessment through Repair of Damaged Device. In 2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2023. Institute of Electrical and Electronics Engineers Inc. 2023. (Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA). doi: 10.1109/IPFA58228.2023.10249101

Hardware Security Assessment through Repair of Damaged Device

Abstract

Publication series

Conference

Bibliographical note

ASJC Scopus Subject Areas

Keywords

Access to Document

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