High-Density 3D-Boron Nitride and 3D-Graphene for High-Performance Nano-Thermal Interface Material

Manuela Loeblein; Siu Hon Tsang; Matthieu Pawlik; Eric Jian Rong Phua; Han Yong; Xiao Wu Zhang; Chee Lip Gan; Edwin Hang Tong Teo

doi:10.1021/acsnano.6b08218

High-Density 3D-Boron Nitride and 3D-Graphene for High-Performance Nano-Thermal Interface Material

Manuela Loeblein, Siu Hon Tsang, Matthieu Pawlik, Eric Jian Rong Phua, Han Yong, Xiao Wu Zhang, Chee Lip Gan, Edwin Hang Tong Teo^*

^*Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

163 Citations (Scopus)

Abstract

Compression studies on three-dimensional foam-like graphene and h-BN (3D-C and 3D-BN) revealed their high cross-plane thermal conductivity (62-86 W m^-1 K^-1) and excellent surface conformity, characteristics essential for thermal management needs. Comparative studies to state-of-the-art materials and other materials currently under research for heat dissipation revealed 3D-foam's improved performance (20-30% improved cooling, temperature decrease by ΔT of 44-24 °C).

Original language	English
Pages (from-to)	2033-2044
Number of pages	12
Journal	ACS Nano
Volume	11
Issue number	2
DOIs	https://doi.org/10.1021/acsnano.6b08218
Publication status	Published - Feb 28 2017
Externally published	Yes

Bibliographical note

Publisher Copyright:
© 2017 American Chemical Society.

ASJC Scopus Subject Areas

General Materials Science
General Engineering
General Physics and Astronomy

Keywords

hot-spot removal
nano-thermal interface material
thermal management
three-dimensional graphene
three-dimensional h-BN

Access to Document

10.1021/acsnano.6b08218

Cite this

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title = "High-Density 3D-Boron Nitride and 3D-Graphene for High-Performance Nano-Thermal Interface Material",

abstract = "Compression studies on three-dimensional foam-like graphene and h-BN (3D-C and 3D-BN) revealed their high cross-plane thermal conductivity (62-86 W m-1 K-1) and excellent surface conformity, characteristics essential for thermal management needs. Comparative studies to state-of-the-art materials and other materials currently under research for heat dissipation revealed 3D-foam's improved performance (20-30% improved cooling, temperature decrease by ΔT of 44-24 °C).",

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T1 - High-Density 3D-Boron Nitride and 3D-Graphene for High-Performance Nano-Thermal Interface Material

AU - Loeblein, Manuela

AU - Tsang, Siu Hon

AU - Pawlik, Matthieu

AU - Phua, Eric Jian Rong

AU - Yong, Han

AU - Zhang, Xiao Wu

AU - Gan, Chee Lip

AU - Teo, Edwin Hang Tong

PY - 2017/2/28

Y1 - 2017/2/28

N2 - Compression studies on three-dimensional foam-like graphene and h-BN (3D-C and 3D-BN) revealed their high cross-plane thermal conductivity (62-86 W m-1 K-1) and excellent surface conformity, characteristics essential for thermal management needs. Comparative studies to state-of-the-art materials and other materials currently under research for heat dissipation revealed 3D-foam's improved performance (20-30% improved cooling, temperature decrease by ΔT of 44-24 °C).

AB - Compression studies on three-dimensional foam-like graphene and h-BN (3D-C and 3D-BN) revealed their high cross-plane thermal conductivity (62-86 W m-1 K-1) and excellent surface conformity, characteristics essential for thermal management needs. Comparative studies to state-of-the-art materials and other materials currently under research for heat dissipation revealed 3D-foam's improved performance (20-30% improved cooling, temperature decrease by ΔT of 44-24 °C).

KW - hot-spot removal

KW - nano-thermal interface material

KW - thermal management

KW - three-dimensional graphene

KW - three-dimensional h-BN

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High-Density 3D-Boron Nitride and 3D-Graphene for High-Performance Nano-Thermal Interface Material

Abstract

Bibliographical note

ASJC Scopus Subject Areas

Keywords

Access to Document

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