High density diffusion barrier of ionized metal plasma deposited Ti in Al-0.5% Cu/Ti/SiO2/Si structure

S. Li*, Y. K. Lee, W. Gao, T. White, Z. L. Dong, K. Maung Latt

*Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

10 Citations (Scopus)

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Biochemistry, Genetics and Molecular Biology

Immunology and Microbiology