Highly conductive aligned carbon film for interconnect application

Fushan Li; Maziar Shakerzadeh; Chongwei Tan; Hongyu Yu; Bengkang Tay

doi:10.1109/INEC.2010.5424560

Highly conductive aligned carbon film for interconnect application

Fushan Li, Maziar Shakerzadeh, Chongwei Tan, Hongyu Yu^*, Bengkang Tay

^*Corresponding author for this work

Nanyang Technological University

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

We demonstrate here an amorphous carbon film with a highly conductive transition phase for interconnect application. The uniform orientation of graphite-like sheet provides an effective carriers transport channel, thus significantly improves the conductivity of the amorphous carbon film. The electrical properties of the aligned carbon film are investigated using Kelvin structure. Our results show that the resistivity of aligned carbon film is comparable with that of Cu, and the aligned carbon film holds promise for future interconnect application.

Original language	English
Title of host publication	INEC 2010 - 2010 3rd International Nanoelectronics Conference, Proceedings
Pages	730-731
Number of pages	2
DOIs	https://doi.org/10.1109/INEC.2010.5424560
Publication status	Published - 2010
Externally published	Yes
Event	2010 3rd International Nanoelectronics Conference, INEC 2010 - Hongkong, China Duration: Jan 3 2010 → Jan 8 2010

Publication series

Name	INEC 2010 - 2010 3rd International Nanoelectronics Conference, Proceedings

Conference

Conference	2010 3rd International Nanoelectronics Conference, INEC 2010
Country/Territory	China
City	Hongkong
Period	1/3/10 → 1/8/10

ASJC Scopus Subject Areas

Electrical and Electronic Engineering

Access to Document

10.1109/INEC.2010.5424560

Cite this

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title = "Highly conductive aligned carbon film for interconnect application",

abstract = "We demonstrate here an amorphous carbon film with a highly conductive transition phase for interconnect application. The uniform orientation of graphite-like sheet provides an effective carriers transport channel, thus significantly improves the conductivity of the amorphous carbon film. The electrical properties of the aligned carbon film are investigated using Kelvin structure. Our results show that the resistivity of aligned carbon film is comparable with that of Cu, and the aligned carbon film holds promise for future interconnect application.",

author = "Fushan Li and Maziar Shakerzadeh and Chongwei Tan and Hongyu Yu and Bengkang Tay",

year = "2010",

doi = "10.1109/INEC.2010.5424560",

language = "English",

isbn = "9781424435449",

series = "INEC 2010 - 2010 3rd International Nanoelectronics Conference, Proceedings",

pages = "730--731",

booktitle = "INEC 2010 - 2010 3rd International Nanoelectronics Conference, Proceedings",

note = "2010 3rd International Nanoelectronics Conference, INEC 2010 ; Conference date: 03-01-2010 Through 08-01-2010",

}

Li, F, Shakerzadeh, M, Tan, C, Yu, H & Tay, B 2010, Highly conductive aligned carbon film for interconnect application. in INEC 2010 - 2010 3rd International Nanoelectronics Conference, Proceedings., 5424560, INEC 2010 - 2010 3rd International Nanoelectronics Conference, Proceedings, pp. 730-731, 2010 3rd International Nanoelectronics Conference, INEC 2010, Hongkong, China, 1/3/10. https://doi.org/10.1109/INEC.2010.5424560

Highly conductive aligned carbon film for interconnect application. / Li, Fushan; Shakerzadeh, Maziar; Tan, Chongwei et al.
INEC 2010 - 2010 3rd International Nanoelectronics Conference, Proceedings. 2010. p. 730-731 5424560 (INEC 2010 - 2010 3rd International Nanoelectronics Conference, Proceedings).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

TY - GEN

T1 - Highly conductive aligned carbon film for interconnect application

AU - Li, Fushan

AU - Shakerzadeh, Maziar

AU - Tan, Chongwei

AU - Yu, Hongyu

AU - Tay, Bengkang

PY - 2010

Y1 - 2010

N2 - We demonstrate here an amorphous carbon film with a highly conductive transition phase for interconnect application. The uniform orientation of graphite-like sheet provides an effective carriers transport channel, thus significantly improves the conductivity of the amorphous carbon film. The electrical properties of the aligned carbon film are investigated using Kelvin structure. Our results show that the resistivity of aligned carbon film is comparable with that of Cu, and the aligned carbon film holds promise for future interconnect application.

AB - We demonstrate here an amorphous carbon film with a highly conductive transition phase for interconnect application. The uniform orientation of graphite-like sheet provides an effective carriers transport channel, thus significantly improves the conductivity of the amorphous carbon film. The electrical properties of the aligned carbon film are investigated using Kelvin structure. Our results show that the resistivity of aligned carbon film is comparable with that of Cu, and the aligned carbon film holds promise for future interconnect application.

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DO - 10.1109/INEC.2010.5424560

M3 - Conference contribution

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T3 - INEC 2010 - 2010 3rd International Nanoelectronics Conference, Proceedings

SP - 730

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BT - INEC 2010 - 2010 3rd International Nanoelectronics Conference, Proceedings

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Y2 - 3 January 2010 through 8 January 2010

ER -

Highly conductive aligned carbon film for interconnect application

Abstract

Publication series

Conference

ASJC Scopus Subject Areas

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