TY - GEN
T1 - Hybrid EM/circuit modeling for carbon nanotubes based interconnects
AU - Brun, Christophe
AU - Franck, Pierre
AU - Chong, Yap Chin
AU - Tan, Dunlin
AU - Teo Hang Tong, Edwin
AU - Bila, Stéphane
AU - Baillargeat, Dominique
AU - Tay, Beng Kang
PY - 2011
Y1 - 2011
N2 - In this paper, carbon nanotube models for high-frequency interconnect applications are studied applying electromagnetic and circuit approaches. A first validation of both models gives a better understanding of carbon nanotubes behaviors in RF. The complex surface impedance used in this paper is derived from Hanson's conductivity in order to take in consideration the quantum capacitance and all other components existing in nano-scale world. A study of CNT inter-coupling is then possible within a transmission line configuration above a ground plane. In future devices, nano-interconnect based on CNTs will be gathered within bundles, a better comprehension of coupling inside and around this bundle allows developing complex CNT bundle models. A RF device approach using CNT bundle models is brought at the end of this paper.
AB - In this paper, carbon nanotube models for high-frequency interconnect applications are studied applying electromagnetic and circuit approaches. A first validation of both models gives a better understanding of carbon nanotubes behaviors in RF. The complex surface impedance used in this paper is derived from Hanson's conductivity in order to take in consideration the quantum capacitance and all other components existing in nano-scale world. A study of CNT inter-coupling is then possible within a transmission line configuration above a ground plane. In future devices, nano-interconnect based on CNTs will be gathered within bundles, a better comprehension of coupling inside and around this bundle allows developing complex CNT bundle models. A RF device approach using CNT bundle models is brought at the end of this paper.
UR - http://www.scopus.com/inward/record.url?scp=84860891512&partnerID=8YFLogxK
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U2 - 10.1109/EPTC.2011.6184406
DO - 10.1109/EPTC.2011.6184406
M3 - Conference contribution
AN - SCOPUS:84860891512
SN - 9781457719837
T3 - 2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011
SP - 158
EP - 162
BT - 2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011
T2 - 2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011
Y2 - 7 December 2011 through 9 December 2011
ER -