Hybrid EM/circuit modeling for carbon nanotubes based interconnects

Christophe Brun*, Pierre Franck, Yap Chin Chong, Dunlin Tan, Edwin Teo Hang Tong, Stéphane Bila, Dominique Baillargeat, Beng Kang Tay

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Abstract

In this paper, carbon nanotube models for high-frequency interconnect applications are studied applying electromagnetic and circuit approaches. A first validation of both models gives a better understanding of carbon nanotubes behaviors in RF. The complex surface impedance used in this paper is derived from Hanson's conductivity in order to take in consideration the quantum capacitance and all other components existing in nano-scale world. A study of CNT inter-coupling is then possible within a transmission line configuration above a ground plane. In future devices, nano-interconnect based on CNTs will be gathered within bundles, a better comprehension of coupling inside and around this bundle allows developing complex CNT bundle models. A RF device approach using CNT bundle models is brought at the end of this paper.

Original languageEnglish
Title of host publication2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011
Pages158-162
Number of pages5
DOIs
Publication statusPublished - 2011
Externally publishedYes
Event2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011 - Singapore, Singapore
Duration: Dec 7 2011Dec 9 2011

Publication series

Name2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011

Conference

Conference2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011
Country/TerritorySingapore
CitySingapore
Period12/7/1112/9/11

ASJC Scopus Subject Areas

  • Electrical and Electronic Engineering

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