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Hygro-thermo-mechanical modeling of mixed flip-chip and wire bond stacked die BGA module with molded underfill
Xueren Zhang*, Tong Yan Tee, Hun Shen Ng, Jerome Teysseyre, Shane Loo, Subodh Mhaisalkar, Fong Kuan Ng, Chwee Teck Lim, Xinyu Du, Eric Bool, Wenhui Zhu, Spencer Chew
*Corresponding author for this work
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
4
Citations
(Scopus)