Abstract
The 17th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2010) was held July 5 to 9 at the Suntec Singapore International Convention and Exhibition Center. There were nine invited papers, and the Best Papers from the 35th International Symposium for Testing and Failure Analysis (ISTFA 2009) and the 20th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF 2009) were presented. An equipment exhibition with 24 exhibitors was held in parallel with the symposium, and this year, IPFA was generously supported by sponsors FEI Company and Digit Concept. The Art of Failure Analysis photo contest again proved popular, with many artistic, unusual, and imaginative images being submitted.
| Original language | English |
|---|---|
| Pages (from-to) | 32-34 |
| Number of pages | 3 |
| Journal | Electronic Device Failure Analysis |
| Volume | 13 |
| Issue number | 1 |
| Publication status | Published - 2010 |
| Externally published | Yes |
ASJC Scopus Subject Areas
- Safety, Risk, Reliability and Quality
- Electrical and Electronic Engineering