Impact of thermal, moisture, and mechanical loading conditions on interfacial fracture toughness of adhesively bonded joints

Shane Loo; Xueren Zhang; Hun Shen Ng; Tong Yan Tee; S. G. Mhaisalkar

doi:10.1007/s11664-006-0065-5

Impact of thermal, moisture, and mechanical loading conditions on interfacial fracture toughness of adhesively bonded joints

Shane Loo^*, Xueren Zhang, Hun Shen Ng, Tong Yan Tee, S. G. Mhaisalkar

^*Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

5 Citations (Scopus)

Abstract

Interfacial delamination is a common failure mode in multilayered IC packages. In this paper, an experimental technique using Brazil-nut specimens is employed to determine the interfacial fracture toughness of an adhesively sandwiched joint with the introduction of edge interfacial crack. The design of experiments (DOE) is applied to study variations in strain rates and the thickness of the sandwich structure. In addition, the effects of moisture content and temperature on the interfacial adhesion are investigated. For the DOEs conducted, as the loading angle increases from 20 °to 90°, the interfacial fracture toughness decreases. The fracture toughness and its corresponding mode mixity are determined from the measured critical load by finite element modeling computation.

Original language	English
Pages (from-to)	110-116
Number of pages	7
Journal	Journal of Electronic Materials
Volume	36
Issue number	2
DOIs	https://doi.org/10.1007/s11664-006-0065-5
Publication status	Published - Feb 2007
Externally published	Yes

ASJC Scopus Subject Areas

Electronic, Optical and Magnetic Materials
Condensed Matter Physics
Electrical and Electronic Engineering
Materials Chemistry

Keywords

Brazil nut
Fracture mechanics
Interfacial fracture toughness
Sandwich joints

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10.1007/s11664-006-0065-5

Cite this

@article{a2e875cb934c4420922991b6fbdfb763,

title = "Impact of thermal, moisture, and mechanical loading conditions on interfacial fracture toughness of adhesively bonded joints",

abstract = "Interfacial delamination is a common failure mode in multilayered IC packages. In this paper, an experimental technique using Brazil-nut specimens is employed to determine the interfacial fracture toughness of an adhesively sandwiched joint with the introduction of edge interfacial crack. The design of experiments (DOE) is applied to study variations in strain rates and the thickness of the sandwich structure. In addition, the effects of moisture content and temperature on the interfacial adhesion are investigated. For the DOEs conducted, as the loading angle increases from 20 °to 90°, the interfacial fracture toughness decreases. The fracture toughness and its corresponding mode mixity are determined from the measured critical load by finite element modeling computation.",

keywords = "Brazil nut, Fracture mechanics, Interfacial fracture toughness, Sandwich joints",

author = "Shane Loo and Xueren Zhang and Ng, {Hun Shen} and Tee, {Tong Yan} and Mhaisalkar, {S. G.}",

year = "2007",

month = feb,

doi = "10.1007/s11664-006-0065-5",

language = "English",

volume = "36",

pages = "110--116",

journal = "Journal of Electronic Materials",

issn = "0361-5235",

publisher = "Springer New York",

number = "2",

}

TY - JOUR

T1 - Impact of thermal, moisture, and mechanical loading conditions on interfacial fracture toughness of adhesively bonded joints

AU - Loo, Shane

AU - Zhang, Xueren

AU - Ng, Hun Shen

AU - Tee, Tong Yan

AU - Mhaisalkar, S. G.

PY - 2007/2

Y1 - 2007/2

N2 - Interfacial delamination is a common failure mode in multilayered IC packages. In this paper, an experimental technique using Brazil-nut specimens is employed to determine the interfacial fracture toughness of an adhesively sandwiched joint with the introduction of edge interfacial crack. The design of experiments (DOE) is applied to study variations in strain rates and the thickness of the sandwich structure. In addition, the effects of moisture content and temperature on the interfacial adhesion are investigated. For the DOEs conducted, as the loading angle increases from 20 °to 90°, the interfacial fracture toughness decreases. The fracture toughness and its corresponding mode mixity are determined from the measured critical load by finite element modeling computation.

AB - Interfacial delamination is a common failure mode in multilayered IC packages. In this paper, an experimental technique using Brazil-nut specimens is employed to determine the interfacial fracture toughness of an adhesively sandwiched joint with the introduction of edge interfacial crack. The design of experiments (DOE) is applied to study variations in strain rates and the thickness of the sandwich structure. In addition, the effects of moisture content and temperature on the interfacial adhesion are investigated. For the DOEs conducted, as the loading angle increases from 20 °to 90°, the interfacial fracture toughness decreases. The fracture toughness and its corresponding mode mixity are determined from the measured critical load by finite element modeling computation.

KW - Brazil nut

KW - Fracture mechanics

KW - Interfacial fracture toughness

KW - Sandwich joints

UR - http://www.scopus.com/inward/record.url?scp=33947597044&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=33947597044&partnerID=8YFLogxK

U2 - 10.1007/s11664-006-0065-5

DO - 10.1007/s11664-006-0065-5

M3 - Article

AN - SCOPUS:33947597044

SN - 0361-5235

VL - 36

SP - 110

EP - 116

JO - Journal of Electronic Materials

JF - Journal of Electronic Materials

IS - 2

ER -

Impact of thermal, moisture, and mechanical loading conditions on interfacial fracture toughness of adhesively bonded joints

Abstract

ASJC Scopus Subject Areas

Keywords

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