Impact of thermal, moisture, and mechanical loading conditions on interfacial fracture toughness of adhesively bonded joints

Shane Loo*, Xueren Zhang, Hun Shen Ng, Tong Yan Tee, S. G. Mhaisalkar

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

5 Citations (Scopus)

Fingerprint

Dive into the research topics of 'Impact of thermal, moisture, and mechanical loading conditions on interfacial fracture toughness of adhesively bonded joints'. Together they form a unique fingerprint.

Keyphrases

Material Science

Engineering