Improved mechanical and thermomechanical properties of alumina substrate via iron doping

Riko I Made*, Eric Jian Rong Phua, Stevin Snellius Pramana, Chee Cheong Wong, Zhong Chen, Alfred Iing Yoong Tok, Chee Lip Gan

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

1 Citation (Scopus)

Abstract

We present a method to improve the overall properties of sintered alumina substrate via iron doping that has a higher fracture toughness, lower thermal conductivity, lower thermal expansion coefficient and comparable dielectric constant than pure alumina. Such properties are beneficial for harsh environment electronic packages. X-ray and electron probe microanalyses concluded that toughening is likely caused by multiple phase strengthening and ruled out crack bridging or grain boundary strengthening.

Original languageEnglish
Pages (from-to)869-872
Number of pages4
JournalScripta Materialia
Volume68
Issue number11
DOIs
Publication statusPublished - Jun 2013
Externally publishedYes

ASJC Scopus Subject Areas

  • General Materials Science
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering
  • Metals and Alloys

Keywords

  • Ceramics
  • Electronics packaging
  • Harsh environment
  • High pressure
  • High temperature

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