Abstract
We present a method to improve the overall properties of sintered alumina substrate via iron doping that has a higher fracture toughness, lower thermal conductivity, lower thermal expansion coefficient and comparable dielectric constant than pure alumina. Such properties are beneficial for harsh environment electronic packages. X-ray and electron probe microanalyses concluded that toughening is likely caused by multiple phase strengthening and ruled out crack bridging or grain boundary strengthening.
Original language | English |
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Pages (from-to) | 869-872 |
Number of pages | 4 |
Journal | Scripta Materialia |
Volume | 68 |
Issue number | 11 |
DOIs | |
Publication status | Published - Jun 2013 |
Externally published | Yes |
ASJC Scopus Subject Areas
- General Materials Science
- Condensed Matter Physics
- Mechanics of Materials
- Mechanical Engineering
- Metals and Alloys
Keywords
- Ceramics
- Electronics packaging
- Harsh environment
- High pressure
- High temperature