Interaction of anti-adhesive silicone films with UV embossing resin

Y. H. Yan; M. B. Chan-Park; W. C. Ching; C. Y. Yue

doi:10.1016/j.apsusc.2004.12.013

Interaction of anti-adhesive silicone films with UV embossing resin

Y. H. Yan, M. B. Chan-Park^*, W. C. Ching, C. Y. Yue

^*Corresponding author for this work

Nanyang Technological University

Research output: Contribution to journal › Article › peer-review

11 Citations (Scopus)

Abstract

The durability of two silicone films, which were formed from silicone-based release agents with different molecular weights (MW), as anti-adhesive coatings for molds used for UV embossing was investigated. Flat electroless nickel-plated polyester stamp and UV-curable polyethylene glycol diacrylate (PEGDA) were the mold and molding material, respectively. The surface chemical composition of the silicone films and the PEGDA moldings was analyzed by X-ray photoelectron spectroscopy (XPS) as a function of molding times using the same nickelized polyester stamp. Silicone transfer was found to occur from the silicone films to the moldings with increased number of moldings. The silicone film formed from the release agent with the higher MW had the poorer durability. Two mechanisms are proposed for the material transfer.

Original language	English
Pages (from-to)	332-339
Number of pages	8
Journal	Applied Surface Science
Volume	249
Issue number	1-4
DOIs	https://doi.org/10.1016/j.apsusc.2004.12.013
Publication status	Published - Aug 15 2005
Externally published	Yes

ASJC Scopus Subject Areas

General Chemistry
Condensed Matter Physics
General Physics and Astronomy
Surfaces and Interfaces
Surfaces, Coatings and Films

Keywords

Anti-adhesion
Silicone-based release agent
Thin film
UV molding
XPS

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10.1016/j.apsusc.2004.12.013

Cite this

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title = "Interaction of anti-adhesive silicone films with UV embossing resin",

abstract = "The durability of two silicone films, which were formed from silicone-based release agents with different molecular weights (MW), as anti-adhesive coatings for molds used for UV embossing was investigated. Flat electroless nickel-plated polyester stamp and UV-curable polyethylene glycol diacrylate (PEGDA) were the mold and molding material, respectively. The surface chemical composition of the silicone films and the PEGDA moldings was analyzed by X-ray photoelectron spectroscopy (XPS) as a function of molding times using the same nickelized polyester stamp. Silicone transfer was found to occur from the silicone films to the moldings with increased number of moldings. The silicone film formed from the release agent with the higher MW had the poorer durability. Two mechanisms are proposed for the material transfer.",

keywords = "Anti-adhesion, Silicone-based release agent, Thin film, UV molding, XPS",

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year = "2005",

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AU - Yan, Y. H.

AU - Chan-Park, M. B.

AU - Ching, W. C.

AU - Yue, C. Y.

PY - 2005/8/15

Y1 - 2005/8/15

N2 - The durability of two silicone films, which were formed from silicone-based release agents with different molecular weights (MW), as anti-adhesive coatings for molds used for UV embossing was investigated. Flat electroless nickel-plated polyester stamp and UV-curable polyethylene glycol diacrylate (PEGDA) were the mold and molding material, respectively. The surface chemical composition of the silicone films and the PEGDA moldings was analyzed by X-ray photoelectron spectroscopy (XPS) as a function of molding times using the same nickelized polyester stamp. Silicone transfer was found to occur from the silicone films to the moldings with increased number of moldings. The silicone film formed from the release agent with the higher MW had the poorer durability. Two mechanisms are proposed for the material transfer.

AB - The durability of two silicone films, which were formed from silicone-based release agents with different molecular weights (MW), as anti-adhesive coatings for molds used for UV embossing was investigated. Flat electroless nickel-plated polyester stamp and UV-curable polyethylene glycol diacrylate (PEGDA) were the mold and molding material, respectively. The surface chemical composition of the silicone films and the PEGDA moldings was analyzed by X-ray photoelectron spectroscopy (XPS) as a function of molding times using the same nickelized polyester stamp. Silicone transfer was found to occur from the silicone films to the moldings with increased number of moldings. The silicone film formed from the release agent with the higher MW had the poorer durability. Two mechanisms are proposed for the material transfer.

KW - Anti-adhesion

KW - Silicone-based release agent

KW - Thin film

KW - UV molding

KW - XPS

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Interaction of anti-adhesive silicone films with UV embossing resin

Abstract

ASJC Scopus Subject Areas

Keywords

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