Interfacial evolution and bond reliability in thermosonic Pd coated Cu wire bonding on aluminum metallization: Effect of palladium distribution

Adeline B.Y. Lim*, Chris B. Boothroyd, Oranna Yauw, Bob Chylak, Chee Lip Gan, Zhong Chen

*Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

17 Citations (Scopus)

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