Abstract
Solid state diffusion bonding of Inconel alloy 718 has been studied and the effect of bonding temperature on the joint microstructure was assessed. The results have shown that partial recrystallization occurs in joints bonded at temperatures lower than 970°C, at a bond pressure of 32 MPa after 60 min. Some unbonded area also appeared in the joints. As the bonding temperature increased beyond 970°C, all the micro-discontinuities were eliminated. Common grains formed in the interface. In as received material, γ″ was of disc shape, the aspect ratio (the ratio of disk diameter over thickness) was about 4. After solid-state diffusion bonding, γ″ was changed to spheres, with the aspect ratio about 1.25.
| Original language | English |
|---|---|
| Pages (from-to) | 223-228 |
| Number of pages | 6 |
| Journal | Key Engineering Materials |
| Volume | 227 |
| Publication status | Published - 2002 |
| Externally published | Yes |
| Event | Proceedings of the Symposium L: Modeling, Materials and its Applications in Advanced Technologies, International Conference on Materials for Advanced Technologies - Singapore, Singapore Duration: Jul 1 2001 → Jul 6 2001 |
ASJC Scopus Subject Areas
- General Materials Science
- Mechanics of Materials
- Mechanical Engineering
Keywords
- Alloy 718
- Diffusion bonding
- Microstructure
- Nickel based superalloy
- Solid-state