Abstract
Although pre-laser decapsulation reduces the time to acid exposure for subsequent chemical decapsulation of copper wirebonded devices, it can result in severely damaged or broken copper wirebonds if carried out at a focused depth followed by chemical decapsulation. Thin quad flat packages (TQFPs) of dimensions 22 mm × 22 mm, with copper wirebonds were pre-laser decapped (Nd:YAG laser, 1064 nm) at three depths of focus, at focus, (z-0.5) mm and (z-1) mm. Reducing the laser focus depth by 1 mm, followed by subsequent chemical decapsulation, resulted in the least damage to copper wirebonds. Average percentage reduction in copper wirebond diameter after complete (laser and chemical) decapsulation is about 2.30%.
Original language | English |
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Pages | 94-99 |
Number of pages | 6 |
Publication status | Published - 2014 |
Externally published | Yes |
Event | 40th International Symposium for Testing and Failure Analysis, ISTFA 2014 - Houston, United States Duration: Nov 9 2014 → Nov 13 2014 |
Conference
Conference | 40th International Symposium for Testing and Failure Analysis, ISTFA 2014 |
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Country/Territory | United States |
City | Houston |
Period | 11/9/14 → 11/13/14 |
Bibliographical note
Publisher Copyright:Copyright © 2014 ASM International® All rights reserved.
ASJC Scopus Subject Areas
- Control and Systems Engineering
- Safety, Risk, Reliability and Quality
- Electrical and Electronic Engineering