Laser focus depth adaptation for decapsulation of copper wirebonded devices

H. B. Kor, Q. Liu, Y. W. Siah, C. L. Gan

Research output: Contribution to conferencePaperpeer-review

3 Citations (Scopus)

Abstract

Although pre-laser decapsulation reduces the time to acid exposure for subsequent chemical decapsulation of copper wirebonded devices, it can result in severely damaged or broken copper wirebonds if carried out at a focused depth followed by chemical decapsulation. Thin quad flat packages (TQFPs) of dimensions 22 mm × 22 mm, with copper wirebonds were pre-laser decapped (Nd:YAG laser, 1064 nm) at three depths of focus, at focus, (z-0.5) mm and (z-1) mm. Reducing the laser focus depth by 1 mm, followed by subsequent chemical decapsulation, resulted in the least damage to copper wirebonds. Average percentage reduction in copper wirebond diameter after complete (laser and chemical) decapsulation is about 2.30%.

Original languageEnglish
Pages94-99
Number of pages6
Publication statusPublished - 2014
Externally publishedYes
Event40th International Symposium for Testing and Failure Analysis, ISTFA 2014 - Houston, United States
Duration: Nov 9 2014Nov 13 2014

Conference

Conference40th International Symposium for Testing and Failure Analysis, ISTFA 2014
Country/TerritoryUnited States
CityHouston
Period11/9/1411/13/14

Bibliographical note

Publisher Copyright:
Copyright © 2014 ASM International® All rights reserved.

ASJC Scopus Subject Areas

  • Control and Systems Engineering
  • Safety, Risk, Reliability and Quality
  • Electrical and Electronic Engineering

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