Laser focus depth adaptation for decapsulation of copper wirebonded devices

H. B. Kor; Q. Liu; Y. W. Siah; C. L. Gan

Laser focus depth adaptation for decapsulation of copper wirebonded devices

H. B. Kor, Q. Liu, Y. W. Siah, C. L. Gan

Nanyang Technological University

Research output: Contribution to conference › Paper › peer-review

3 Citations (Scopus)

Abstract

Although pre-laser decapsulation reduces the time to acid exposure for subsequent chemical decapsulation of copper wirebonded devices, it can result in severely damaged or broken copper wirebonds if carried out at a focused depth followed by chemical decapsulation. Thin quad flat packages (TQFPs) of dimensions 22 mm × 22 mm, with copper wirebonds were pre-laser decapped (Nd:YAG laser, 1064 nm) at three depths of focus, at focus, (z-0.5) mm and (z-1) mm. Reducing the laser focus depth by 1 mm, followed by subsequent chemical decapsulation, resulted in the least damage to copper wirebonds. Average percentage reduction in copper wirebond diameter after complete (laser and chemical) decapsulation is about 2.30%.

Original language	English
Pages	94-99
Number of pages	6
Publication status	Published - 2014
Externally published	Yes
Event	40th International Symposium for Testing and Failure Analysis, ISTFA 2014 - Houston, United States Duration: Nov 9 2014 → Nov 13 2014

Conference

Conference	40th International Symposium for Testing and Failure Analysis, ISTFA 2014
Country/Territory	United States
City	Houston
Period	11/9/14 → 11/13/14

Bibliographical note

Publisher Copyright:
Copyright © 2014 ASM International® All rights reserved.

ASJC Scopus Subject Areas

Control and Systems Engineering
Safety, Risk, Reliability and Quality
Electrical and Electronic Engineering

Cite this

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title = "Laser focus depth adaptation for decapsulation of copper wirebonded devices",

abstract = "Although pre-laser decapsulation reduces the time to acid exposure for subsequent chemical decapsulation of copper wirebonded devices, it can result in severely damaged or broken copper wirebonds if carried out at a focused depth followed by chemical decapsulation. Thin quad flat packages (TQFPs) of dimensions 22 mm × 22 mm, with copper wirebonds were pre-laser decapped (Nd:YAG laser, 1064 nm) at three depths of focus, at focus, (z-0.5) mm and (z-1) mm. Reducing the laser focus depth by 1 mm, followed by subsequent chemical decapsulation, resulted in the least damage to copper wirebonds. Average percentage reduction in copper wirebond diameter after complete (laser and chemical) decapsulation is about 2.30%.",

author = "Kor, {H. B.} and Q. Liu and Siah, {Y. W.} and Gan, {C. L.}",

note = "Publisher Copyright: Copyright {\textcopyright} 2014 ASM International{\textregistered} All rights reserved.; 40th International Symposium for Testing and Failure Analysis, ISTFA 2014 ; Conference date: 09-11-2014 Through 13-11-2014",

year = "2014",

language = "English",

pages = "94--99",

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TY - CONF

T1 - Laser focus depth adaptation for decapsulation of copper wirebonded devices

AU - Kor, H. B.

AU - Liu, Q.

AU - Siah, Y. W.

AU - Gan, C. L.

PY - 2014

Y1 - 2014

N2 - Although pre-laser decapsulation reduces the time to acid exposure for subsequent chemical decapsulation of copper wirebonded devices, it can result in severely damaged or broken copper wirebonds if carried out at a focused depth followed by chemical decapsulation. Thin quad flat packages (TQFPs) of dimensions 22 mm × 22 mm, with copper wirebonds were pre-laser decapped (Nd:YAG laser, 1064 nm) at three depths of focus, at focus, (z-0.5) mm and (z-1) mm. Reducing the laser focus depth by 1 mm, followed by subsequent chemical decapsulation, resulted in the least damage to copper wirebonds. Average percentage reduction in copper wirebond diameter after complete (laser and chemical) decapsulation is about 2.30%.

AB - Although pre-laser decapsulation reduces the time to acid exposure for subsequent chemical decapsulation of copper wirebonded devices, it can result in severely damaged or broken copper wirebonds if carried out at a focused depth followed by chemical decapsulation. Thin quad flat packages (TQFPs) of dimensions 22 mm × 22 mm, with copper wirebonds were pre-laser decapped (Nd:YAG laser, 1064 nm) at three depths of focus, at focus, (z-0.5) mm and (z-1) mm. Reducing the laser focus depth by 1 mm, followed by subsequent chemical decapsulation, resulted in the least damage to copper wirebonds. Average percentage reduction in copper wirebond diameter after complete (laser and chemical) decapsulation is about 2.30%.

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M3 - Paper

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T2 - 40th International Symposium for Testing and Failure Analysis, ISTFA 2014

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ER -

Laser focus depth adaptation for decapsulation of copper wirebonded devices

Abstract

Conference

Bibliographical note

ASJC Scopus Subject Areas

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