Layer inversion of Ni(Pt)Si on mixed phase Si films

P. S. Lee*, K. L. Pey, D. Mangelinck, J. Ding, T. Osipowicz, A. See

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

11 Citations (Scopus)

Abstract

The formation of Ni silicides has been improved with Ni(Pt)-silicidation on the mixed phase Si films which were grown using the rapid thermal chemical vapor deposition technique. The Ni(Pt)Si was stabilized up to 800°C and layer inversion was retarded beyond 600°C. The enhanced stability of Ni(Pt)Si is attributed to the change in Gibbs free energy. The reduced layer inversion is due to the modification of the Si microstructure that has played an important role in the layer inversion. The enlarged poly-Si grains from the mixed phase films are due to the silicide enhanced mediated crystallization using NiSi2 precipitates as seeds besides the preexisting Si crystallites.

Original languageEnglish
Pages (from-to)G15-G17
JournalElectrochemical and Solid-State Letters
Volume5
Issue number3
DOIs
Publication statusPublished - Mar 2002
Externally publishedYes

ASJC Scopus Subject Areas

  • General Chemical Engineering
  • General Materials Science
  • Physical and Theoretical Chemistry
  • Electrochemistry
  • Electrical and Electronic Engineering

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