Length effects on the reliability of dual-damascene Cu interconnects

F. Wei; C. L. Gan; C. V. Thompson; J. J. Clement; S. P. Hau-Riege; K. L. Pey; W. K. Choi; H. L. Tay; B. Yu; M. K. Radhakrishnan

doi:10.1557/proc-716-b13.3

Length effects on the reliability of dual-damascene Cu interconnects

F. Wei^*, C. L. Gan, C. V. Thompson, J. J. Clement, S. P. Hau-Riege, K. L. Pey, W. K. Choi, H. L. Tay, B. Yu, M. K. Radhakrishnan

^*Corresponding author for this work

Research output: Contribution to journal › Conference article › peer-review

12 Citations (Scopus)

Original language	English
Pages (from-to)	645-650
Number of pages	6
Journal	Materials Research Society Symposium - Proceedings
Volume	716
DOIs	https://doi.org/10.1557/proc-716-b13.3
Publication status	Published - 2002
Externally published	Yes
Event	Silicon Materials - Processing, Characterization and Reliability - San Francisco, CA, United States Duration: Apr 1 2002 → Apr 5 2002

ASJC Scopus Subject Areas

General Materials Science
Condensed Matter Physics
Mechanics of Materials
Mechanical Engineering

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10.1557/proc-716-b13.3

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@article{1f2c2120c07a4e2799aabc310974878f,

title = "Length effects on the reliability of dual-damascene Cu interconnects",

author = "F. Wei and Gan, {C. L.} and Thompson, {C. V.} and Clement, {J. J.} and Hau-Riege, {S. P.} and Pey, {K. L.} and Choi, {W. K.} and Tay, {H. L.} and B. Yu and Radhakrishnan, {M. K.}",

year = "2002",

doi = "10.1557/proc-716-b13.3",

language = "English",

volume = "716",

pages = "645--650",

journal = "Materials Research Society Symposium - Proceedings",

issn = "0272-9172",

publisher = "Materials Research Society",

note = "Silicon Materials - Processing, Characterization and Reliability ; Conference date: 01-04-2002 Through 05-04-2002",

}

TY - JOUR

T1 - Length effects on the reliability of dual-damascene Cu interconnects

AU - Wei, F.

AU - Gan, C. L.

AU - Thompson, C. V.

AU - Clement, J. J.

AU - Hau-Riege, S. P.

AU - Pey, K. L.

AU - Choi, W. K.

AU - Tay, H. L.

AU - Yu, B.

AU - Radhakrishnan, M. K.

PY - 2002

Y1 - 2002

UR - http://www.scopus.com/inward/record.url?scp=0036954979&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0036954979&partnerID=8YFLogxK

U2 - 10.1557/proc-716-b13.3

DO - 10.1557/proc-716-b13.3

M3 - Conference article

AN - SCOPUS:0036954979

SN - 0272-9172

VL - 716

SP - 645

EP - 650

JO - Materials Research Society Symposium - Proceedings

JF - Materials Research Society Symposium - Proceedings

T2 - Silicon Materials - Processing, Characterization and Reliability

Y2 - 1 April 2002 through 5 April 2002

ER -

Length effects on the reliability of dual-damascene Cu interconnects

ASJC Scopus Subject Areas

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