Mechanical properties and microstructure of Ca-doped gold bonding wire

Saraswati; S. T. Sritharan; C. D. Breach; F. Wulff; S. G. Mhaisalkar

doi:10.1109/EPTC.2003.1271585

Mechanical properties and microstructure of Ca-doped gold bonding wire

Saraswati, S. T. Sritharan, C. D. Breach, F. Wulff, S. G. Mhaisalkar

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

1 Citation (Scopus)

Abstract

Gold bonding wire is the most widely used electrical interconnection in semiconductor devices, but wire bonds are also a major source of failure in IC packaging. This paper reports a study of microstructure and mechanical behaviour of 5N pure and doped gold wire and gold rods that were studied by TEM, depth sensing indentation and tensile testing. A possible strengthening mechanism is then proposed.

Original language	English
Title of host publication	Proceedings of 5th Electronics Packaging Technology Conference, EPTC 2003
Editors	Mahadevan K. Iyer, Yew Cheong Mui, Kok Chuan Toh
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	569-573
Number of pages	5
ISBN (Electronic)	0780382056, 9780780382053
DOIs	https://doi.org/10.1109/EPTC.2003.1271585
Publication status	Published - 2003
Externally published	Yes
Event	5th Electronics Packaging Technology Conference, EPTC 2003 - Singapore, Singapore Duration: Dec 10 2003 → Dec 12 2003

Publication series

Name	Proceedings of 5th Electronics Packaging Technology Conference, EPTC 2003

Conference

Conference	5th Electronics Packaging Technology Conference, EPTC 2003
Country/Territory	Singapore
City	Singapore
Period	12/10/03 → 12/12/03

Bibliographical note

Publisher Copyright:
© 2003 IEEE.

ASJC Scopus Subject Areas

Electrical and Electronic Engineering
Industrial and Manufacturing Engineering
Electronic, Optical and Magnetic Materials

Access to Document

10.1109/EPTC.2003.1271585

Cite this

Saraswati, Sritharan, S. T., Breach, C. D., Wulff, F., & Mhaisalkar, S. G. (2003). Mechanical properties and microstructure of Ca-doped gold bonding wire. In M. K. Iyer, Y. C. Mui, & K. C. Toh (Eds.), Proceedings of 5th Electronics Packaging Technology Conference, EPTC 2003 (pp. 569-573). Article 1271585 (Proceedings of 5th Electronics Packaging Technology Conference, EPTC 2003). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EPTC.2003.1271585

Saraswati ; Sritharan, S. T. ; Breach, C. D. et al. / Mechanical properties and microstructure of Ca-doped gold bonding wire. Proceedings of 5th Electronics Packaging Technology Conference, EPTC 2003. editor / Mahadevan K. Iyer ; Yew Cheong Mui ; Kok Chuan Toh. Institute of Electrical and Electronics Engineers Inc., 2003. pp. 569-573 (Proceedings of 5th Electronics Packaging Technology Conference, EPTC 2003).

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abstract = "Gold bonding wire is the most widely used electrical interconnection in semiconductor devices, but wire bonds are also a major source of failure in IC packaging. This paper reports a study of microstructure and mechanical behaviour of 5N pure and doped gold wire and gold rods that were studied by TEM, depth sensing indentation and tensile testing. A possible strengthening mechanism is then proposed.",

author = "Saraswati and Sritharan, {S. T.} and Breach, {C. D.} and F. Wulff and Mhaisalkar, {S. G.}",

note = "Publisher Copyright: {\textcopyright} 2003 IEEE.; 5th Electronics Packaging Technology Conference, EPTC 2003 ; Conference date: 10-12-2003 Through 12-12-2003",

year = "2003",

doi = "10.1109/EPTC.2003.1271585",

language = "English",

series = "Proceedings of 5th Electronics Packaging Technology Conference, EPTC 2003",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

pages = "569--573",

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Saraswati, Sritharan, ST, Breach, CD, Wulff, F & Mhaisalkar, SG 2003, Mechanical properties and microstructure of Ca-doped gold bonding wire. in MK Iyer, YC Mui & KC Toh (eds), Proceedings of 5th Electronics Packaging Technology Conference, EPTC 2003., 1271585, Proceedings of 5th Electronics Packaging Technology Conference, EPTC 2003, Institute of Electrical and Electronics Engineers Inc., pp. 569-573, 5th Electronics Packaging Technology Conference, EPTC 2003, Singapore, Singapore, 12/10/03. https://doi.org/10.1109/EPTC.2003.1271585

Mechanical properties and microstructure of Ca-doped gold bonding wire. / Saraswati; Sritharan, S. T.; Breach, C. D. et al.
Proceedings of 5th Electronics Packaging Technology Conference, EPTC 2003. ed. / Mahadevan K. Iyer; Yew Cheong Mui; Kok Chuan Toh. Institute of Electrical and Electronics Engineers Inc., 2003. p. 569-573 1271585 (Proceedings of 5th Electronics Packaging Technology Conference, EPTC 2003).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

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AB - Gold bonding wire is the most widely used electrical interconnection in semiconductor devices, but wire bonds are also a major source of failure in IC packaging. This paper reports a study of microstructure and mechanical behaviour of 5N pure and doped gold wire and gold rods that were studied by TEM, depth sensing indentation and tensile testing. A possible strengthening mechanism is then proposed.

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A2 - Iyer, Mahadevan K.

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Saraswati, Sritharan ST, Breach CD, Wulff F, Mhaisalkar SG. Mechanical properties and microstructure of Ca-doped gold bonding wire. In Iyer MK, Mui YC, Toh KC, editors, Proceedings of 5th Electronics Packaging Technology Conference, EPTC 2003. Institute of Electrical and Electronics Engineers Inc. 2003. p. 569-573. 1271585. (Proceedings of 5th Electronics Packaging Technology Conference, EPTC 2003). doi: 10.1109/EPTC.2003.1271585

Mechanical properties and microstructure of Ca-doped gold bonding wire

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ASJC Scopus Subject Areas

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