Mechanical properties and microstructure of Ca-doped gold bonding wire

Engineering

• Bonding Wire 100%
• Tensile Testing 50%
• Indentation 50%
• Mechanical Property 50%
• Semiconductor Device 50%
• Rod 50%
• Gold Wire 50%
• Strengthening Mechanism 50%

Keyphrases

• Ca Doping 100%
• Depth-sensing Indentation 50%
• Microstructure Studies 50%
• Indentation Test 50%
• Wire Rod 50%
• Gold Rod 50%
• Microstructure Behavior 50%

Material Science

• Tensile Testing 100%
• Semiconductor Device 100%
• Indentation 100%
• Mechanical Property 100%