Mechanical property characterization of Cu-Sn-In intermetallic thin films using microcantilevers

W. A. Sasangka; C. L. Gan; C. V. Thompson

doi:10.1109/IPFA.2011.5992788

Mechanical property characterization of Cu-Sn-In intermetallic thin films using microcantilevers

W. A. Sasangka^*, C. L. Gan, C. V. Thompson

^*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

Young's modulus, residual stress and fracture strength of Cu-Sn-In intermetallic thin films are characterized using deflection of microcantilevers and beam mechanics. It is shown through finite element modelling and experiments that deflection of the beams at multiple locations allows correction for non-ideality of the beams originating from the undercut, anticlastic curvature and stress gradient. This method has the advantage over common indentation-based approaches, in that with a single sample we can simultaneously extract the Young's modulus, residual stress and fracture strength of the film. Additionally, knowledge of the Poisson's ratio is not required for the calculation of the Young's modulus.

Original language	English
Title of host publication	18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2011
DOIs	https://doi.org/10.1109/IPFA.2011.5992788
Publication status	Published - 2011
Externally published	Yes
Event	18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2011 - Incheon, Korea, Republic of Duration: Jul 4 2011 → Jul 7 2011

Publication series

Name	Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA

Conference

Conference	18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2011
Country/Territory	Korea, Republic of
City	Incheon
Period	7/4/11 → 7/7/11

ASJC Scopus Subject Areas

Electrical and Electronic Engineering

Access to Document

10.1109/IPFA.2011.5992788

Cite this

Sasangka, W. A., Gan, C. L., & Thompson, C. V. (2011). Mechanical property characterization of Cu-Sn-In intermetallic thin films using microcantilevers. In 18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2011 Article 5992788 (Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA). https://doi.org/10.1109/IPFA.2011.5992788

Sasangka, W. A. ; Gan, C. L. ; Thompson, C. V. / Mechanical property characterization of Cu-Sn-In intermetallic thin films using microcantilevers. 18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2011. 2011. (Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA).

@inproceedings{3aea8392df284f93a6774f7180f75451,

title = "Mechanical property characterization of Cu-Sn-In intermetallic thin films using microcantilevers",

abstract = "Young's modulus, residual stress and fracture strength of Cu-Sn-In intermetallic thin films are characterized using deflection of microcantilevers and beam mechanics. It is shown through finite element modelling and experiments that deflection of the beams at multiple locations allows correction for non-ideality of the beams originating from the undercut, anticlastic curvature and stress gradient. This method has the advantage over common indentation-based approaches, in that with a single sample we can simultaneously extract the Young's modulus, residual stress and fracture strength of the film. Additionally, knowledge of the Poisson's ratio is not required for the calculation of the Young's modulus.",

author = "Sasangka, \{W. A.\} and Gan, \{C. L.\} and Thompson, \{C. V.\}",

year = "2011",

doi = "10.1109/IPFA.2011.5992788",

language = "English",

isbn = "9781457701597",

series = "Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA",

booktitle = "18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2011",

note = "18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2011 ; Conference date: 04-07-2011 Through 07-07-2011",

}

Sasangka, WA, Gan, CL & Thompson, CV 2011, Mechanical property characterization of Cu-Sn-In intermetallic thin films using microcantilevers. in 18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2011., 5992788, Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA, 18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2011, Incheon, Korea, Republic of, 7/4/11. https://doi.org/10.1109/IPFA.2011.5992788

Mechanical property characterization of Cu-Sn-In intermetallic thin films using microcantilevers. / Sasangka, W. A.; Gan, C. L.; Thompson, C. V.
18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2011. 2011. 5992788 (Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

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AB - Young's modulus, residual stress and fracture strength of Cu-Sn-In intermetallic thin films are characterized using deflection of microcantilevers and beam mechanics. It is shown through finite element modelling and experiments that deflection of the beams at multiple locations allows correction for non-ideality of the beams originating from the undercut, anticlastic curvature and stress gradient. This method has the advantage over common indentation-based approaches, in that with a single sample we can simultaneously extract the Young's modulus, residual stress and fracture strength of the film. Additionally, knowledge of the Poisson's ratio is not required for the calculation of the Young's modulus.

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Sasangka WA, Gan CL, Thompson CV. Mechanical property characterization of Cu-Sn-In intermetallic thin films using microcantilevers. In 18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2011. 2011. 5992788. (Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA). doi: 10.1109/IPFA.2011.5992788

Mechanical property characterization of Cu-Sn-In intermetallic thin films using microcantilevers

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