Microstructural features of solid-state diffusion bonded Incoloy MA 956

Guoge Zhang, Roop Singh Chandel*, Hong Pheow Seow, Huey Hoon Hng

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

5 Citations (Scopus)

Abstract

The microstructural features of diffusion bonded MA 956 joints were examined. It was found that the grain size and grain aspect ratio did not change after bonding. A toothlike structure was observed near the joint interface at higher bonding pressures. Large irregularly shaped particles were formed as a result of the interaction between dislocations and precipitates. A mechanism based on dislocation movement and interaction has been proposed to explain the formation of these particles. The distribution and size of yttria dispersoids remained unaffected under the bonding conditions investigated.

Original languageEnglish
Pages (from-to)599-608
Number of pages10
JournalMaterials and Manufacturing Processes
Volume18
Issue number4
DOIs
Publication statusPublished - Jul 2003
Externally publishedYes

ASJC Scopus Subject Areas

  • General Materials Science
  • Mechanics of Materials
  • Mechanical Engineering
  • Industrial and Manufacturing Engineering

Keywords

  • Diffusion bonding
  • Microstructure
  • Oxide dispersion strengthened (ODS) alloy
  • Scanning electron microscopy (SEM)
  • Transmission electron microscopy (TEM)

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