Millimeter Wave Carbon Nanotube Based Flip Chip Coplanar Interconnects

Joseph M. De Saxce; Philippe Roux-Levy; Chun Fei Siah; Jianxiong Wang; Beng Kang Tay; Philippe Coquet; Dominique Baillargeat

doi:10.1109/EPTC50525.2020.9314999

Millimeter Wave Carbon Nanotube Based Flip Chip Coplanar Interconnects

Joseph M. De Saxce^*, Philippe Roux-Levy, Chun Fei Siah, Jianxiong Wang, Beng Kang Tay, Philippe Coquet, Dominique Baillargeat

^*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

1 Citation (Scopus)

Abstract

In this work, we investigate the performances of vertically aligned carbon nanotube (VACNT) arrays for high frequency interconnects. The frequency range of this study is the W band (75 GHz to 110 GHz). The type of interconnect is coplanar, meaning the interconnect can connect two subparts supporting a coplanar waveguide (CPW) mode. Starting from the promising results of a previously measured device [1] we suggest a way to improve the behavior of VACNT arrays interconnects. We perform full-wave modeling of a new structure that will be fabricated and tested and we compare different modelling approaches for the design of such interconnects.

Original language	English
Title of host publication	2020 IEEE 22nd Electronics Packaging Technology Conference, EPTC 2020
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	81-84
Number of pages	4
ISBN (Electronic)	9781728189116
DOIs	https://doi.org/10.1109/EPTC50525.2020.9314999
Publication status	Published - Dec 2 2020
Externally published	Yes
Event	22nd IEEE Electronics Packaging Technology Conference, EPTC 2020 - Virtual, Singapore, Singapore Duration: Dec 2 2020 → Dec 4 2020

Publication series

Name	2020 IEEE 22nd Electronics Packaging Technology Conference, EPTC 2020

Conference

Conference	22nd IEEE Electronics Packaging Technology Conference, EPTC 2020
Country/Territory	Singapore
City	Virtual, Singapore
Period	12/2/20 → 12/4/20

Bibliographical note

Publisher Copyright:
© 2020 IEEE.

ASJC Scopus Subject Areas

Electrical and Electronic Engineering
Safety, Risk, Reliability and Quality
Electronic, Optical and Magnetic Materials

Access to Document

10.1109/EPTC50525.2020.9314999

Cite this

De Saxce, J. M., Roux-Levy, P., Siah, C. F., Wang, J., Tay, B. K., Coquet, P., & Baillargeat, D. (2020). Millimeter Wave Carbon Nanotube Based Flip Chip Coplanar Interconnects. In 2020 IEEE 22nd Electronics Packaging Technology Conference, EPTC 2020 (pp. 81-84). Article 9314999 (2020 IEEE 22nd Electronics Packaging Technology Conference, EPTC 2020). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EPTC50525.2020.9314999

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abstract = "In this work, we investigate the performances of vertically aligned carbon nanotube (VACNT) arrays for high frequency interconnects. The frequency range of this study is the W band (75 GHz to 110 GHz). The type of interconnect is coplanar, meaning the interconnect can connect two subparts supporting a coplanar waveguide (CPW) mode. Starting from the promising results of a previously measured device [1] we suggest a way to improve the behavior of VACNT arrays interconnects. We perform full-wave modeling of a new structure that will be fabricated and tested and we compare different modelling approaches for the design of such interconnects.",

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doi = "10.1109/EPTC50525.2020.9314999",

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De Saxce, JM, Roux-Levy, P, Siah, CF, Wang, J, Tay, BK, Coquet, P & Baillargeat, D 2020, Millimeter Wave Carbon Nanotube Based Flip Chip Coplanar Interconnects. in 2020 IEEE 22nd Electronics Packaging Technology Conference, EPTC 2020., 9314999, 2020 IEEE 22nd Electronics Packaging Technology Conference, EPTC 2020, Institute of Electrical and Electronics Engineers Inc., pp. 81-84, 22nd IEEE Electronics Packaging Technology Conference, EPTC 2020, Virtual, Singapore, Singapore, 12/2/20. https://doi.org/10.1109/EPTC50525.2020.9314999

Millimeter Wave Carbon Nanotube Based Flip Chip Coplanar Interconnects. / De Saxce, Joseph M.; Roux-Levy, Philippe; Siah, Chun Fei et al.
2020 IEEE 22nd Electronics Packaging Technology Conference, EPTC 2020. Institute of Electrical and Electronics Engineers Inc., 2020. p. 81-84 9314999 (2020 IEEE 22nd Electronics Packaging Technology Conference, EPTC 2020).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

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AU - Coquet, Philippe

AU - Baillargeat, Dominique

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AB - In this work, we investigate the performances of vertically aligned carbon nanotube (VACNT) arrays for high frequency interconnects. The frequency range of this study is the W band (75 GHz to 110 GHz). The type of interconnect is coplanar, meaning the interconnect can connect two subparts supporting a coplanar waveguide (CPW) mode. Starting from the promising results of a previously measured device [1] we suggest a way to improve the behavior of VACNT arrays interconnects. We perform full-wave modeling of a new structure that will be fabricated and tested and we compare different modelling approaches for the design of such interconnects.

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De Saxce JM, Roux-Levy P, Siah CF, Wang J, Tay BK, Coquet P et al. Millimeter Wave Carbon Nanotube Based Flip Chip Coplanar Interconnects. In 2020 IEEE 22nd Electronics Packaging Technology Conference, EPTC 2020. Institute of Electrical and Electronics Engineers Inc. 2020. p. 81-84. 9314999. (2020 IEEE 22nd Electronics Packaging Technology Conference, EPTC 2020). doi: 10.1109/EPTC50525.2020.9314999

Millimeter Wave Carbon Nanotube Based Flip Chip Coplanar Interconnects

Abstract

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